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Volumn 3, Issue 23, 2015, Pages 5890-5895
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The mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperature
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Author keywords
[No Author keywords available]
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Indexed keywords
CONDUCTIVE FILMS;
ELECTRIC CONDUCTIVITY;
METALLIC FILMS;
NANORODS;
PARTICLE SIZE;
PREHEATING;
REDUCING AGENTS;
SINTERING;
CONDUCTIVE COPPER;
COPPER PARTICLES;
ELECTRICAL CONDUCTIVITY;
HIGH CONDUCTIVITY;
LOW SINTERING TEMPERATURE;
PREHEATING PROCESS;
REDUCING PARTICLE;
REDUCTION REACTION;
COPPER;
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EID: 84930965670
PISSN: 20507534
EISSN: 20507526
Source Type: Journal
DOI: 10.1039/c5tc00745c Document Type: Article |
Times cited : (48)
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References (48)
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