Effect of copper concentration in printable copper inks on film fabrication

Thin Solid Films

Volumn 520, Issue 7, 2012, Pages 2731-2734

  Kim, Suk Jun ^a   Lee, Jaeho ^a   Choi, Yun Hyuk ^a   Yeon, Dong Hee ^a   Byun, Younghun ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Copper formate; Copper inks; Hexylamine; Printed electronics

Indexed keywords

ANNEALING TIME; BOILING TEMPERATURE; COPPER CONCENTRATION; COPPER FORMATE; COPPER-BASED; CU FILMS; ELECTRICAL RESISTIVITY; FILM FABRICATION; HEXYLAMINE; IMPURITY CONTENT; METALLIC INKS; PRINTED ELECTRONICS;

ELECTRIC CONDUCTIVITY; IMPURITIES;

COPPER;

EID: 84856376673     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.11.056     Document Type: Article

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