-
1
-
-
55149088846
-
Direct micro fabrication of flexible copper clad laminate using 355 nm UV laser
-
J. Kim, B. Shin, J. Ko, J. Go, K. Kim, and Y. Jeong Direct micro fabrication of flexible copper clad laminate using 355 nm UV laser Jpn. J. Appl. Phys. 47 2008 6883
-
(2008)
Jpn. J. Appl. Phys.
, vol.47
, pp. 6883
-
-
Kim, J.1
Shin, B.2
Ko, J.3
Go, J.4
Kim, K.5
Jeong, Y.6
-
2
-
-
77956226895
-
Electrical conductivity of copper nanoparticle thin films annealed at low temperature
-
A. Yabuki, and N. Arrifin Electrical conductivity of copper nanoparticle thin films annealed at low temperature Thin Solid Films 518 2010 7033
-
(2010)
Thin Solid Films
, vol.518
, pp. 7033
-
-
Yabuki, A.1
Arrifin, N.2
-
3
-
-
78650271867
-
The effect of reduction atmospheres on the sintering behaviors of inkjet-printed Cu interconnectors
-
I. Kim, and J. Kim The effect of reduction atmospheres on the sintering behaviors of inkjet-printed Cu interconnectors J. Appl. Phys. 108 2010 102807
-
(2010)
J. Appl. Phys.
, vol.108
, pp. 102807
-
-
Kim, I.1
Kim, J.2
-
4
-
-
77951977149
-
A simple way of preparing high-concentration and high-purity nano copper colloid for conductive ink in inkjet printing technology
-
X. Tang, Z. Yang, and W. Wang A simple way of preparing high-concentration and high-purity nano copper colloid for conductive ink in inkjet printing technology Colloids Surf. A Physicochem. Eng. Asp. 360 2010 99
-
(2010)
Colloids Surf. A Physicochem. Eng. Asp.
, vol.360
, pp. 99
-
-
Tang, X.1
Yang, Z.2
Wang, W.3
-
5
-
-
78649940483
-
Ink-jet printing of Cu conductive ink on flexible substrate modified by oxygen plasma treatment
-
Y. Goo, Y. Lee, N. Kim, K. Lee, B. Yoo, S. Hong, J. Kiom, and Y. Choa Ink-jet printing of Cu conductive ink on flexible substrate modified by oxygen plasma treatment Surf. Coat. Technol. 205 2010 S369
-
(2010)
Surf. Coat. Technol.
, vol.205
, pp. 369
-
-
Goo, Y.1
Lee, Y.2
Kim, N.3
Lee, K.4
Yoo, B.5
Hong, S.6
Kiom, J.7
Choa, Y.8
-
6
-
-
36148965547
-
Influence of ligand structure on the stability and oxidation of copper nanoparticles
-
P. Kanninen, C. Johans, J. Merta, and K. Konturri Influence of ligand structure on the stability and oxidation of copper nanoparticles J. Colloid Interface Sci. 318 2008 88
-
(2008)
J. Colloid Interface Sci.
, vol.318
, pp. 88
-
-
Kanninen, P.1
Johans, C.2
Merta, J.3
Konturri, K.4
-
7
-
-
41049118182
-
The preparation of copper fine particle paste and its application as the inner electrode material of a multilayered ceramic capacitor
-
T. Yonezawa, S. Takeoka, H. Kishi, K. Ida, and M. Tomonari The preparation of copper fine particle paste and its application as the inner electrode material of a multilayered ceramic capacitor Nanotechnology 19 2008 145706
-
(2008)
Nanotechnology
, vol.19
, pp. 145706
-
-
Yonezawa, T.1
Takeoka, S.2
Kishi, H.3
Ida, K.4
Tomonari, M.5
-
8
-
-
34547596792
-
Direct writing of copper conductive patterns by ink-jet printing
-
B. Park, D. Kim, S. Jeong, J. Moon, and J. Kim Direct writing of copper conductive patterns by ink-jet printing Thin Solid Films 515 2007 7706
-
(2007)
Thin Solid Films
, vol.515
, pp. 7706
-
-
Park, B.1
Kim, D.2
Jeong, S.3
Moon, J.4
Kim, J.5
-
9
-
-
84877699026
-
Investigation of sintering behavior of octanethiol-coated copper nano ink under various atmospheres
-
Md.M. Haque, D. Cho, and C.S. Lee Investigation of sintering behavior of octanethiol-coated copper nano ink under various atmospheres Thin Solid Films 536 2013 32
-
(2013)
Thin Solid Films
, vol.536
, pp. 32
-
-
Haque, Md.M.1
Cho, D.2
Lee, C.S.3
-
10
-
-
67349089046
-
A low-cure-temperature copper nano ink for highly conductive printed electrodes
-
B. Lee, Y. Kim, S. Yang, I. Jeong, and J. Moon A low-cure-temperature copper nano ink for highly conductive printed electrodes Curr. Appl. Phys. 9 2009 e157
-
(2009)
Curr. Appl. Phys.
, vol.9
, pp. 157
-
-
Lee, B.1
Kim, Y.2
Yang, S.3
Jeong, I.4
Moon, J.5
-
11
-
-
84868205866
-
Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines
-
A. Yabuki, and S. Tanaka Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines Mater. Res. Bull. 47 2012 4107
-
(2012)
Mater. Res. Bull.
, vol.47
, pp. 4107
-
-
Yabuki, A.1
Tanaka, S.2
-
12
-
-
84856376673
-
Effect of copper concentration in printable copper inks on film fabrication
-
S. Kim, J. Lee, Y. Choi, D. Yeon, and Y. Byun Effect of copper concentration in printable copper inks on film fabrication Thin Solid Films 520 2012 2731
-
(2012)
Thin Solid Films
, vol.520
, pp. 2731
-
-
Kim, S.1
Lee, J.2
Choi, Y.3
Yeon, D.4
Byun, Y.5
-
13
-
-
84856367485
-
Behavior of Cu nanoparticles ink under reductive calcination for fabrication of Cu conductive film
-
K. Ida, M. Tomonan, Y. Sugiyama, Y. Chujyo, T. Tokunaga, T. Yonezawa, K. Kuroda, and K. Sasaki Behavior of Cu nanoparticles ink under reductive calcination for fabrication of Cu conductive film Thin Solid Films 520 2012 2789
-
(2012)
Thin Solid Films
, vol.520
, pp. 2789
-
-
Ida, K.1
Tomonan, M.2
Sugiyama, Y.3
Chujyo, Y.4
Tokunaga, T.5
Yonezawa, T.6
Kuroda, K.7
Sasaki, K.8
-
14
-
-
80054741162
-
Laser sintering of Cu paste film printed on polyimide substrate
-
M. Joo, B. Lee, S. Jeong, and M. Lee Laser sintering of Cu paste film printed on polyimide substrate Appl. Surf. Sci. 258 2011 521
-
(2011)
Appl. Surf. Sci.
, vol.258
, pp. 521
-
-
Joo, M.1
Lee, B.2
Jeong, S.3
Lee, M.4
-
15
-
-
84856368982
-
Comparative studies on thermal and laser sintering for highly conductive Cu films printable on plastic substrate
-
M. Joo, B. Lee, S. Jeong, and M. Lee Comparative studies on thermal and laser sintering for highly conductive Cu films printable on plastic substrate Thin Solid Films 520 2012 2878
-
(2012)
Thin Solid Films
, vol.520
, pp. 2878
-
-
Joo, M.1
Lee, B.2
Jeong, S.3
Lee, M.4
-
16
-
-
84896354103
-
A self-reducible and alcohol-soluble copper-based metal-organic decomposition ink for printed electronics
-
D. Shin, S. Woo, H. Yem, M. Cha, S. Cho, M. Kang, S. Jeong, Y. Kim, K. Kang, and Y. Piao A self-reducible and alcohol-soluble copper-based metal-organic decomposition ink for printed electronics ACS Appl. Mater. Interfaces 6 2014 3312
-
(2014)
ACS Appl. Mater. Interfaces
, vol.6
, pp. 3312
-
-
Shin, D.1
Woo, S.2
Yem, H.3
Cha, M.4
Cho, S.5
Kang, M.6
Jeong, S.7
Kim, Y.8
Kang, K.9
Piao, Y.10
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