Behavior of Cu nanoparticles ink under reductive calcination for fabrication of Cu conductive film

Thin Solid Films

Volumn 520, Issue 7, 2012, Pages 2789-2793

  Ida, Kiyonobu ^a,b   Tomonari, Masanori ^b   Sugiyama, Yasuyuki ^a   Chujyo, Yuki ^a   Tokunaga, Tomoharu ^a   Yonezawa, Tetsu ^c   Kuroda, Kotaro ^a   Sasaki, Katsuhiro ^a  

^a NAGOYA UNIVERSITY   (Japan)

^b Functional Materials RandD Division   (Japan)

^c HOKKAIDO UNIVERSITY   (Japan)

Author keywords

Conductive films; Copper; Ink; Nanoparticles; Printed electronics; Scanning electron microscopy; Transmission electron microscopy

Indexed keywords

AVERAGE DIAMETER; CU NANOPARTICLES; CU OXIDE; GELATIN LAYERS; LOW RESISTIVITY; MIXED GAS; POLYIMIDE SUBSTRATE; PRINTED ELECTRONICS; SCANNING ELECTRONS; TRANSMISSION ELECTRON; TWO-STEP ANNEALING;

CALCINATION; COPPER; FLOW OF GASES; INK; NANOPARTICLES; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SINTERING; TRANSMISSION ELECTRON MICROSCOPY;

CONDUCTIVE FILMS;

EID: 84856367485     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.12.024     Document Type: Article

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