Influences of pad shape and solder microstructure on shear force of low cost flip chip bumps

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 91-98

  Cai, Jian ^a   Law, Simon ^a   Teng, Annette ^a   Chan, Philip C H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COSTS; ELECTROLESS PLATING; FLIP CHIP DEVICES; FRACTURE; HYDROGEN EMBRITTLEMENT; MODIFIED ATMOSPHERE PACKAGING; NICKEL; SOLDERING ALLOYS; STUDS (FASTENERS); STUDS (STRUCTURAL MEMBERS);

ELECTROLESS NICKEL AND IMMERSION GOLDS; ELECTROLESS PROCESS; FLIP CHIP TECHNOLOGIES; FRACTURE SURFACES; INTERMETALLIC LAYER; MULTIPLE REFLOWS; SOLDER MICROSTRUCTURE; STENCIL PRINTING;

SOLDERING;

EID: 84954219534     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904138     Document Type: Conference Paper

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