Low cost bumping by stencil printing: Process qualification for 200 μm pitch

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 288-298

  Kloeser, Joachim ^a   Heinricht, Katrin ^a   Jung, Erik ^a   Lauter, Liane ^a   Ostmann, Andreas ^a   Aschenbrenner, Rolf ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED SOFTWARE ENGINEERING; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; NICKEL; SOLDERING; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

ELECTROLESS NICKEL; SOLDER PASTES; STENCIL PRINTING; WAFER BUMPING;

FLIP CHIP DEVICES;

EID: 0032311889     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)