Effect of Cu stud structure and eutectic solder electroplating on intermetallic growth and reliability of flip-chip solder bump

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 54-59

  Xiao, Guowei ^a   Chan, Philip ^a   Jian, Cai ^a   Teng, Annette ^a   Yuen, Matthew ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; COPPER; DEFECTS; ELECTROPLATING; EUTECTICS; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SOLDERED JOINTS; SOLDERING; SURFACE ROUGHNESS; SURFACE STRUCTURE;

COPPER STUD STRUCTURE; EUTECTIC SOLDER ELECTROPLATING; FRACTURE SURFACE STRUCTURE; MICROSTRUCTURAL MORPHOLOGY; SOLDER BUMP; UNDER BUMP METALLURGY;

FLIP CHIP DEVICES;

EID: 0034476304     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)