Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 89-94

  Ng, Wei Chin ^a   Ko, Tze Man ^a   Chen, William ^a   Qi, Guo Jun ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; ELECTROLESS PLATING; ENERGY DISPERSIVE SPECTROSCOPY; FLIP CHIP DEVICES; MICROELECTRONICS; MORPHOLOGY; NICKEL; SCANNING ELECTRON MICROSCOPY; SOLDERING; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

IMMERSION ZINCATION; UNDER BUMP MATERIALS (UBM);

ELECTRONICS PACKAGING;

EID: 0032230479     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)