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Volumn 515, Issue , 1998, Pages 55-66
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Effects of interfaces on C-4 solder bump reliability
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
CRACK PROPAGATION;
CREEP;
GRAIN BOUNDARIES;
INTERMETALLICS;
METALLIZING;
MICROELECTRONICS;
RELIABILITY;
SEMICONDUCTOR INSULATOR BOUNDARIES;
SOLDERING ALLOYS;
SUBSTRATES;
REFLOW SOLDERING;
SOLDER BUMP RELIABILITY;
ELECTRONICS PACKAGING;
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EID: 0031635717
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-515-55 Document Type: Conference Paper |
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Times cited : (5)
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References (15)
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