Investigation of self-heating phenomenon in small geometry vias using scanning Joule expansion microscopy

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1999, Pages 297-302

  Banerjee, Kaustav ^a   Wu, Guanghua ^a   Igeta, Masanobu ^a   Amerasekera, Ajith ^a   Majumdar, Arun ^a   Hu, Chenming ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CURRENT DENSITY; IMAGE PROCESSING; INTEGRATED CIRCUIT TESTING; MICROSCOPES; RELIABILITY; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS; THERMODYNAMIC PROPERTIES; VLSI CIRCUITS;

PULSED CURRENT STRESS; SCANNING JOULE EXPANSION MICROSCOPY; SINUSOIDAL CURRENT STRESS; TEMPERATURE RISE; THERMAL TIME CONSTANT; W PLUG VIAS;

THERMAL VARIABLES MEASUREMENT;

EID: 0032646375     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (14)