Cohesive Zone Model for the Interface of Multiwalled Carbon Nanotubes and Copper: Molecular Dynamics Simulation

Journal of Nanotechnology in Engineering and Medicine

Volumn 5, Issue 3, 2014, Pages

  Awad, Ibrahim ^a   Ladani, Leila ^a  

^a UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; COPPER; DISPLACEMENT CONTROL; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS; MOLECULAR DYNAMICS; THREE DIMENSIONAL INTEGRATED CIRCUITS; VAN DER WAALS FORCES; YARN;

COHESIVE ZONE MODEL; MECHANICAL AND ELECTRICAL PROPERTIES; MECHANICAL INTEGRITY; MOLECULAR DYNAMICS SIMULATIONS; MULTIWALLED CARBON NANOTUBE (MWCNTS); STRESS DISPLACEMENT CURVES; THROUGH SILICON VIAS; VAN DER WAALS INTERACTION;

MULTIWALLED CARBON NANOTUBES (MWCN);

COPPER; MULTI WALLED NANOTUBE;

ARTICLE; COHESIVE ZONE MODEL; MATHEMATICAL COMPUTING; METHODOLOGY; MOLECULAR DYNAMICS; MOLECULAR INTERACTION; NONLINEAR SYSTEM; TEMPERATURE SENSITIVITY;

EID: 84940668936     PISSN: 19492944     EISSN: 19492952     Source Type: Journal    
DOI: 10.1115/1.4029462     Document Type: Article

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