Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013

Volumn , Issue , 2013, Pages

  Hartmann, Steffen ^a   Hölck, Ole ^a,b   Wunderle, Bernhard ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING ENERGIES; BONDING STRENGTH; FORCE-DISPLACEMENT DATA; LATTICE DIRECTIONS; MECHANICAL CHARACTERIZATIONS; MECHANICAL LOADS; MOLECULAR DYNAMICS SIMULATIONS; STRUCTURAL DEFECT;

DIFFUSION BONDING; EXPERIMENTS; GOLD; MICROELECTRONICS; MICROSYSTEMS; MOLECULAR DYNAMICS;

POLYTETRAFLUOROETHYLENES;

EID: 84880981867     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EuroSimE.2013.6529903     Document Type: Conference Paper

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