Thermal analysis of Cu-organic composite nanoparticles and fabrication of highly conductive copper films

Journal of Alloys and Compounds

Volumn 649, Issue , 2015, Pages 1156-1163

  Li, Yujie ^a   Huo, Yao ^a   Li, Changguang ^a   Xing, Songling ^b   Liu, Lei ^b   Zou, Guisheng ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Conductive thin films; Cu organic composite nanoparticles; Resistivity; Sintering; Thermal analysis

Indexed keywords

COMPOSITE FILMS; COMPOSITE MATERIALS; CONDUCTIVE FILMS; COPPER; ELECTRIC CONDUCTIVITY; METALLIC FILMS; NANOPARTICLES; SINTERING; SODIUM DODECYL SULFATE; SODIUM SULFATE; SYNTHESIS (CHEMICAL); THERMOANALYSIS; THIN FILMS;

CONDUCTIVE THIN FILMS; DECOMPOSITION PRODUCTS; INTERCONNECTION STRUCTURE; ORGANIC COMPOSITES; POLY(VINYL PYRROLIDONE); REDUCTION REACTION; SINTERING TEMPERATURES; TEMPERATURE RANGE;

NANOCOMPOSITE FILMS;

EID: 84938686212     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2015.07.248     Document Type: Article

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