Flame-driven aerosol synthesis of copper-nickel nanopowders and conductive nanoparticle films

ACS Applied Materials and Interfaces

Volumn 6, Issue 16, 2014, Pages 13542-13551

  Sharma, Munish K ^a   Qi, Di ^a   Buchner, Raymond D ^a   Scharmach, William J ^b   Papavassiliou, Vasilis ^b   Swihart, Mark T ^a  

^a State University of New York   (United States)

^b PRAXAIR INC   (United States)

Author keywords

conductivity; copper; nanoparticles; nickel; sintering

Indexed keywords

AEROSOLS; COPPER; DEPOSITION; ELECTRIC CONDUCTIVITY; FLAME SYNTHESIS; INK; METALS; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NICKEL; NICKEL COATINGS; OXIDATION RESISTANCE; SILVER NANOPARTICLES; SINTERING; SYNTHESIS (CHEMICAL);

AMBIENT CONDITIONS; CONDUCTIVE NANOPARTICLES; ELECTRICAL CONDUCTIVITY; METAL SALT PRECURSORS; NANOSTRUCTURED COATINGS; ONE STEP SYNTHESIS; PRECURSOR SOLUTIONS; SINTERING TEMPERATURES;

METAL NANOPARTICLES;

EID: 84906807344     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am5026853     Document Type: Article

References (39)

1. Athanassiou, E. K.; Grass, R. N.; Stark, W. J. Chemical Aerosol Engineering as a Novel Tool for Material Science: From Oxides to Salt and Metal Nanoparticles Aerosol Sci. Technol. 2010, 44, 161-172
2. Buesser, B.; Pratsinis, S. E. Design of Nanomaterial Synthesis by Aerosol Processes Annu. Rev. Chem. Biomol. Eng. 2012, 3, 103-127
3. An, W.-J.; Thimsen, E.; Biswas, P. Aerosol-Chemical Vapor Deposition Method For Synthesis of Nanostructured Metal Oxide Thin Films With Controlled Morphology J. Phys. Chem. Lett. 2010, 1, 249-253
4. 2 Thin Films: High Gas-Sensing Properties by Control of Morphology Sens. Actuators, B 2010, 150, 609-615
5. 2 Crystalline Films over Premixed Stagnation Flames Proc. Combust. Inst. 2009, 32, 1839-1845
6. 2 Films with Controlled Morphologies by Stagnation Swirl Flames J. Aerosol. Sci. 2012, 44, 71-82
7. Sahm, T.; Rong, W. H.; Barsan, N.; Madler, L.; Friedlander, S. K.; Weimar, U. Formation of Multilayer Films for Gas Sensing by in Situ Thermophoretic Deposition of Nanoparticles from Aerosol Phase J. Mater. Res. 2007, 22, 850-857
8. Anthony, R. J.; Cheng, K.-Y.; Holman, Z. C.; Holmes, R. J.; Kortshagen, U. R. An All-Gas-Phase Approach for the Fabrication of Silicon Nanocrystal Light-Emitting Devices Nano Lett. 2012, 12, 2822-2825
9. Holman, Z. C.; Kortshagen, U. R. A Flexible Method for Depositing Dense Nanocrystal Thin Films: Impaction of Germanium Nanocrystals Nanotechnology 2010, 21, 9
10. Kubo, M.; Ishihara, Y.; Mantani, Y.; Shimada, M. Evaluation of the Factors that Influence the Fabrication of Porous Thin Films by Deposition of Aerosol Nanoparticles Chem. Eng. J. 2013, 232, 221-227
11. CRC Handbook of Chemistry and Physics, 92 ed.; Haynes, W. M., Ed.; CRC Press (an imprint of Taylor & Francis Group): Boca Raton, FL. 2011.
12. Cheon, J. M.; Lee, J. H.; Song, Y.; Kim, J. Synthesis of Ag Nanoparticles Using an Electrolysis Method and Application to Inkjet Printing Colloids Surf., A 2011, 389, 175-179
13. Gamerith, S.; Klug, A.; Scheiber, H.; Scherf, U.; Moderegger, E.; List, E. J. W. Direct Ink-Jet Printing of Ag-Cu Nanoparticle and Ag-precursor based Electrodes for OFET Applications Adv. Funct. Mater. 2007, 17, 3111-3118
14. Grouchko, M.; Kamyshny, A.; Magdassi, S. Formation of Air-Stable Copper-Silver Core-Shell Nanoparticles for Ink-Jet Printing J. Mater. Chem. 2009, 19, 3057-3062
15. Grouchko, M.; Kamyshny, A.; Mihailescu, C. F.; Anghel, D. F.; Magdassi, S. Conductive Inks with a "Built-In" Mechanism That Enables Sintering at Room Temperature ACS Nano 2011, 5, 3354-3359
16. 3Ni) Colloids Surf., A 2008, 331, 206-212
17. Ban, I.; Stergar, J.; Drofenik, M.; Ferk, G.; Makovec, D. Synthesis of Copper-Nickel Nanoparticles Prepared by Mechanical Milling for use in Magnetic Hyperthermia J. Magn. Magn. Mater. 2011, 323, 2254-2258
18. Caglar, U.; Pekkanen, V.; Valkama, J.; Mansikkamaki, P.; Pekkanen, J. Usability of Ink-jet Printing Technology and Nanomaterials in Electrical Interconnections, Electronic Packaging, and System Integration for Microelectronics Applications. In Ceramic Integration and Joining Technologies: From Macro to Nanoscale; Singh, M.; Ohji, T.; Asthana, R.; Mathur, S., Eds.; Wiley: New York, 2011; pp 743-776.
19. Kamyshny, A.; Steinke, J.; Magdassi, S. Metal-based Ink Jet Inks for Printed Electronics Open Appl. Phys. J. 2011, 4, 19-36
20. Chen, S.; Brown, L.; Levendorf, M.; Cai, W.; Ju, S.-Y.; Edgeworth, J.; Li, X.; Magnuson, C. W.; Velamakanni, A.; Piner, R. D.; Kang, J.; Park, J.; Ruoff, R. S. Oxidation Resistance of Graphene-coated Cu and Cu/Ni Alloy ACS Nano 2011, 5, 1321-1327
21. de los, A.; Cangiano, M.; Carreras, A. C.; Ojeda, M. W.; del C. Ruiz, M. A New Chemical Route to Synthesize Cu-Ni Alloy Nanostructured Particles J. Alloys Compd. 2008, 458, 405-409
22. Guo, F.; Lu, T.; Qin, J.; Zheng, H.; Tian, X. Abnormal Resistivity Behavior of Cu-Ni and Cu-Co Alloys in Undercooled Liquid State Phys. B (Amsterdam, Neth.) 2012, 407, 4108-4113
23. Mohan, S.; Rajasekaran, N. Influence of Electrolyte pH on Composition, Corrosion Properties and Surface Morphology of Electrodeposited Cu-Ni Alloy Surf. Eng. 2011, 27, 519-523
24. Khadom, A. A.; Yaro, A. S.; Kadhum, A. A. H. Adsorption Mechanism of Benzotriazole for Corrosion Inhibition of Copper-Nickel Alloy in Hydrochloric Acid J. Chil. Chem. Soc. 2010, 55, 150-152
25. Ghauri, I. M.; Afzal, N.; Shahzad, M.; Mubarik, F. E. Tensile Behavior of Post-irradiation Annealed Cu-Ni Alloy Radiat. Eff. Defects Solids 2011, 166, 228-232
26. Metikos-Hukovic, M.; Babic, R.; Skugor Roncevic, I.; Grubac, Z. Corrosion Resistance of Copper-Nickel Alloy under Fluid Jet Impingement Desalination 2011, 276, 228-232
27. Metikos-Hukovic, M.; Babic, R.; Skugor, I.; Grubac, Z. Copper-Nickel Alloys Modified with Thin Surface Films: Corrosion Behaviour in the Presence of Chloride Ions Corros. Sci. 2010, 53, 347-352
28. Polavarapu, L.; Manga, K. K.; Yu, K.; Ang, P. K.; Cao, H. D.; Balapanuru, J.; Loh, K. P.; Xu, Q.-H. Alkylamine Capped Metal Nanoparticle "Inks" for Printable SERS Substrates, Electronics and Broadband Photodetectors Nanoscale 2011, 3, 2268-2274
29. Oehlund, T.; Oertegren, J.; Forsberg, S.; Nilsson, H.-E. Paper Surfaces for Metal Nanoparticle Inkjet Printing Appl. Surf. Sci. 2012, 259, 731-739
30. Jung, C.-H.; Lee, H.-G.; Kim, C.-J.; Bhaduri, S. B. Synthesis of Cu-Ni Alloy Powder Directly from Metal Salts Solution J. Nanopart. Res. 2003, 5, 383-388
31. Scharmach, W. J.; Buchner, R. D.; Papavassiliou, V.; Pacouloute, P.; Swihart, M. T. A High-Temperature Reducing Jet Reactor for Flame-based Metal Nanoparticle Production Aerosol Sci. Technol. 2010, 44, 1083-1088
32. Sharma, M. K.; Buchner, R. D.; Scharmach, W. J.; Papavassiliou, V.; Swihart, M. T. Creating Conductive Copper-Silver Bimetallic Nanostructured Coatings Using a High Temperature Reducing Jet Aerosol Reactor Aerosol Sci. Technol. 2013, 47, 858-866
33. Dixkens, J.; Fissan, H. Development of an Electrostatic Precipitator for off-Line Particle Analysis Aerosol Sci. Technol. 1999, 30, 438-453
34. Sharma, M. K. Flame-based Synthesis of Multicomponent Metal Nanoparticles and Nanostructured Coatings. Ph.D. Dissertation, State University of New York at Buffalo, 2013.
35. Chen, C. L.; Lee, J. G.; Arakawa, K.; Mori, H. Comparative Study on Size Dependence of Melting Temperatures of Pure Metal and Alloy Nanoparticles Appl. Phys. Lett. 2011, 99, 013108/1-013108/3
36. Levitas, V. I.; Samani, K. Size and Mechanics Effects in Surface-Induced Melting of Nanoparticles Nat. Commun. 2011, 2, 1275/1-1275/6
37. Young, A. P.; Schwartz, C. M. Electrical Conductivity and Thermoelectric Power of Cuprous Oxide J. Phys. Chem. Solids 1969, 30, 249-252
38. Patil, A. U.; Sawant, S. R.; Powar, J. I.; Khot, A. Y.; Patil, R. N. Electrical Conductivity of Copper Oxide Thin Films at Microwave Frequencies Proc. Nucl. Phys. Solid State Phys. Symp. 1978, 21C, 266
39. Makhlouf, S. A. Electrical Properties of NiO Films Obtained by High-Temperature Oxidation of Nickel Thin Solid Films 2008, 516, 3112-3116