A novel method to prepare Cu@Ag core-shell nanoparticles for printed flexible electronics

Powder Technology

Volumn 263, Issue , 2014, Pages 1-6

  Kim, Chang Kyu ^a,b   Lee, Gyoung Ja ^a   Lee, Min Ku ^a   Rhee, Chang Kyu ^a  

^a Korea Atomic Energy Research Institute   (South Korea)

^b University of Science and Technology (UST)   (South Korea)

Author keywords

Cu@Ag core shell nanoparticles; Flexible substrates; Printed electronics; Wire evaporation

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; ETHYLENE GLYCOL; EVAPORATION; FILM PREPARATION; NANOPARTICLES; POLYMERIC FILMS; REDUCTION; SCANNING ELECTRON MICROSCOPY; SHELLS (STRUCTURES); SINTERING; SYNTHESIS (CHEMICAL); TRANSMISSION ELECTRON MICROSCOPY; WIRE; X RAY DIFFRACTION;

COMPOSITION ANALYSIS; CORE-SHELL NANOPARTICLES; ELECTRICAL CONDUCTIVITY; ELECTROCHEMICAL DEPOSITION METHODS; EVAPORATION METHOD; FLEXIBLE SUBSTRATE; PRINTED ELECTRONICS; SCREEN PRINTING METHODS;

SILVER;

COPPER NANOPARTICLE; ETHYLENE GLYCOL; INK; NANOINK; SILVER NANOPARTICLE; UNCLASSIFIED DRUG;

ANALYTIC METHOD; ARTICLE; BIOFILM; CHEMICAL COMPOSITION; CRYSTAL STRUCTURE; ELECTRIC CONDUCTIVITY; ELECTRONICS; MATERIAL COATING; OXIDATION; PRINTED FLEXIBLE ELECTRONICS; PROCESS OPTIMIZATION; PULSED WIRE EVAPORATION METHOD; SCANNING ELECTRON MICROSCOPY; THERMOGRAVIMETRY; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

EID: 84900498343     PISSN: 00325910     EISSN: 1873328X     Source Type: Journal    
DOI: 10.1016/j.powtec.2014.04.064     Document Type: Article

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