메뉴 건너뛰기




Volumn 97, Issue , 2015, Pages 161-171

Effect of iodine on the corrosion of Au-Al wire bonds

Author keywords

A. Aluminium; A. Electronic materials; A. Intermetallics; B. Polarisation; B. X ray diffraction; C. Interfaces

Indexed keywords

ALUMINUM ALLOYS; ALUMINUM METALLOGRAPHY; ALUMINUM OXIDE; BINARY ALLOYS; CORROSIVE EFFECTS; ELECTRONICS PACKAGING; GOLD DEPOSITS; GOLD METALLOGRAPHY; INTERMETALLICS; IODINE; WIRE;

EID: 84930541142     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2015.05.003     Document Type: Article
Times cited : (15)

References (33)
  • 2
    • 76349087479 scopus 로고    scopus 로고
    • Al-Au (aluminum-gold)
    • Okamoto H. Al-Au (aluminum-gold). J. Phase Equilibr. Diffus. 2005, 26(4):391-393.
    • (2005) J. Phase Equilibr. Diffus. , vol.26 , Issue.4 , pp. 391-393
    • Okamoto, H.1
  • 5
    • 16544381586 scopus 로고    scopus 로고
    • Thermodynamic description of the Au-Al system
    • Liu H.S., Wang J., Du Y., Jin Z.P. Thermodynamic description of the Au-Al system. Z. Met. 2004, 95(1):45-49.
    • (2004) Z. Met. , vol.95 , Issue.1 , pp. 45-49
    • Liu, H.S.1    Wang, J.2    Du, Y.3    Jin, Z.P.4
  • 8
    • 3142733017 scopus 로고    scopus 로고
    • Degradation and failure mechanisms in thermally exposed Au-Al ball bonds
    • Noolu N.J., Murdeshwar N.M., Ely K.J., Lippold J.C., Baeslack W.a. Degradation and failure mechanisms in thermally exposed Au-Al ball bonds. J. Mater. Res. 2004, 19(5):1374-1386.
    • (2004) J. Mater. Res. , vol.19 , Issue.5 , pp. 1374-1386
    • Noolu, N.J.1    Murdeshwar, N.M.2    Ely, K.J.3    Lippold, J.C.4    Baeslack, W.5
  • 9
    • 0017292347 scopus 로고
    • The effect of impurities on the corrosion of aluminum metallization
    • Paulson W.M., Lorigan R.P. The effect of impurities on the corrosion of aluminum metallization. Reliab. Phys. Symp. 1976, 42-47.
    • (1976) Reliab. Phys. Symp. , pp. 42-47
    • Paulson, W.M.1    Lorigan, R.P.2
  • 10
    • 0023854641 scopus 로고
    • Effect of high thermal stability mold material on the gold-aluminum bond reliability in epoxy encapsulated VLSI devices
    • Khan M., Fatemi H., Romero J., Delenia E. Effect of high thermal stability mold material on the gold-aluminum bond reliability in epoxy encapsulated VLSI devices. Reliab. Phys. Symp. 1988, 40-49.
    • (1988) Reliab. Phys. Symp. , pp. 40-49
    • Khan, M.1    Fatemi, H.2    Romero, J.3    Delenia, E.4
  • 11
    • 0021316842 scopus 로고
    • Epoxy degradation induced Au-Al intermetallic void formation in plastic encapsulated MOS memories
    • Gale R. Epoxy degradation induced Au-Al intermetallic void formation in plastic encapsulated MOS memories. Reliab. Phys. Symp. 1984, 37-47.
    • (1984) Reliab. Phys. Symp. , pp. 37-47
    • Gale, R.1
  • 12
    • 0019397503 scopus 로고
    • Investigation of the molecular processes controlling corrosion failure mechanisms in plastic encapsulated semiconductor devices
    • Lum R., Feinstein L. Investigation of the molecular processes controlling corrosion failure mechanisms in plastic encapsulated semiconductor devices. Microelectron. Reliab. 1981, 21(1):15-31.
    • (1981) Microelectron. Reliab. , vol.21 , Issue.1 , pp. 15-31
    • Lum, R.1    Feinstein, L.2
  • 14
    • 70450033955 scopus 로고    scopus 로고
    • Failure analysis of halide of epoxy molding compound used for electronic packing, in: International Conference on Electronic Packaging Technology and High Density Packaging
    • Y. Jianhai, B. Shengxiang, M. Lili, L. Dechun, Failure analysis of halide of epoxy molding compound used for electronic packing, in: International Conference on Electronic Packaging Technology and High Density Packaging, 2009, pp. 759-762.
    • (2009) , pp. 759-762
    • Jianhai, Y.1    Shengxiang, B.2    Lili, M.3    Dechun, L.4
  • 15
    • 0019654119 scopus 로고
    • CF4/O2 plasma accelerated aluminum metallization corrosion in plastic encapsulated ICs in the presence of contaminated die attach epoxies
    • Ritchie R., Andrews D. CF4/O2 plasma accelerated aluminum metallization corrosion in plastic encapsulated ICs in the presence of contaminated die attach epoxies. Reliab. Phys. Symp. 1981, 88-92.
    • (1981) Reliab. Phys. Symp. , pp. 88-92
    • Ritchie, R.1    Andrews, D.2
  • 16
    • 0022934669 scopus 로고
    • Gold-aluminum bond failure induced by halogenated additives in epoxy molding compounds, in: International Symposium on Microelectronics
    • H.F.M.M. Khan, Gold-aluminum bond failure induced by halogenated additives in epoxy molding compounds, in: International Symposium on Microelectronics, 1986, pp. 420-427.
    • (1986) , pp. 420-427
    • Khan, H.F.M.M.1
  • 17
    • 39849089595 scopus 로고    scopus 로고
    • Pyrolysis of tetrabromobisphenol-A containing paper laminated printed circuit boards
    • Grause G., Furusawa M., Okuwaki A., Yoshioka T. Pyrolysis of tetrabromobisphenol-A containing paper laminated printed circuit boards. Chemosphere 2008, 71(5):872-878.
    • (2008) Chemosphere , vol.71 , Issue.5 , pp. 872-878
    • Grause, G.1    Furusawa, M.2    Okuwaki, A.3    Yoshioka, T.4
  • 19
    • 84930542892 scopus 로고    scopus 로고
    • Heat Stabilized Polyamide Moulding, US 2010/0120985 A1.
    • H. Qin, N. Sun, R.J. Palmer, Heat Stabilized Polyamide Moulding, US 2010/0120985 A1.
    • Qin, H.1    Sun, N.2    Palmer, R.J.3
  • 20
    • 84930539317 scopus 로고    scopus 로고
    • Heat Stabilization of Polyamides, US2705227 A.
    • S.G. Stoeff, Heat Stabilization of Polyamides, US2705227 A.
    • Stoeff, S.G.1
  • 21
    • 84885462567 scopus 로고    scopus 로고
    • Iodide based polyamide stabilisers as potential risk for corrosion in electronics
    • Leineweber M., Müller L. Iodide based polyamide stabilisers as potential risk for corrosion in electronics. Corros. Eng., Sci. Technol. 2013, 48(6):445-451.
    • (2013) Corros. Eng., Sci. Technol. , vol.48 , Issue.6 , pp. 445-451
    • Leineweber, M.1    Müller, L.2
  • 22
    • 70449775442 scopus 로고    scopus 로고
    • Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system integration, in: European Microelectronics and Packaging Conference
    • R. Klengel, S. Bennemann, J. Schischka, C. Grosse, M. Petzold, Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system integration, in: European Microelectronics and Packaging Conference, 2009.
    • (2009)
    • Klengel, R.1    Bennemann, S.2    Schischka, J.3    Grosse, C.4    Petzold, M.5
  • 23
    • 84893300540 scopus 로고    scopus 로고
    • Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts, in: European Microelectronics Packaging Conference (EMPC)
    • R. Klengel, S. Klengel, T. Stephan, M. Petzold, Novel investigation of influencing factors for corrosive interface degradation in wire bond contacts, in: European Microelectronics Packaging Conference (EMPC), 2013.
    • (2013)
    • Klengel, R.1    Klengel, S.2    Stephan, T.3    Petzold, M.4
  • 24
    • 84930541620 scopus 로고    scopus 로고
    • EIA/JEDEC STANDARD EIA/JESD22-B116, Wire Bond Shear Test Method
    • EIA/JEDEC STANDARD EIA/JESD22-B116, Wire Bond Shear Test Method, 1998.
    • (1998)
  • 25
    • 84930537013 scopus 로고    scopus 로고
    • ASTM F1269-89 Test Methods for Destructive Shear Testing of Ball Bonds
    • ASTM F1269-89 Test Methods for Destructive Shear Testing of Ball Bonds, 2001.
    • (2001)
  • 26
    • 84878470571 scopus 로고    scopus 로고
    • In vitro corrosion of dental Au-based casting alloys in polyvinylpyrrolidone-iodine solution
    • Takasusuki N., Ida Y., Hirose Y., Ochi M., Endo K. In vitro corrosion of dental Au-based casting alloys in polyvinylpyrrolidone-iodine solution. Dent. Mater. J. 2013, 32(3):390-397.
    • (2013) Dent. Mater. J. , vol.32 , Issue.3 , pp. 390-397
    • Takasusuki, N.1    Ida, Y.2    Hirose, Y.3    Ochi, M.4    Endo, K.5
  • 27
    • 84930539524 scopus 로고
    • Plastic outgassing induced wire bond failure, in: 27th Electronic Components Conference
    • R. Thomas, V. Winchell, K. James, T. Scharr, Plastic outgassing induced wire bond failure, in: 27th Electronic Components Conference, 1977, pp. 182-187.
    • (1977) , pp. 182-187
    • Thomas, R.1    Winchell, V.2    James, K.3    Scharr, T.4
  • 28
    • 50149114962 scopus 로고    scopus 로고
    • Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy
    • Ji H., Li M., Kim J., Kim D., Wang C. Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy. Mater. Charact. 2008, 59(10):1419-1424.
    • (2008) Mater. Charact. , vol.59 , Issue.10 , pp. 1419-1424
    • Ji, H.1    Li, M.2    Kim, J.3    Kim, D.4    Wang, C.5
  • 29
    • 7044223209 scopus 로고    scopus 로고
    • Bromine- and chlorine-induced degradation of gold-aluminum bonds
    • Lue M.-H., Huang C.-T., Huang S.-T., Hsieh K.-C. Bromine- and chlorine-induced degradation of gold-aluminum bonds. J. Electron. Mater. 2004, 33(10):1111-1117.
    • (2004) J. Electron. Mater. , vol.33 , Issue.10 , pp. 1111-1117
    • Lue, M.-H.1    Huang, C.-T.2    Huang, S.-T.3    Hsieh, K.-C.4
  • 30
    • 84930537050 scopus 로고    scopus 로고
    • HSC Chemistry 7.1, Outotec (Finland) Oy Information Center.
    • HSC Chemistry 7.1, Outotec (Finland) Oy Information Center.
  • 31
    • 0026122464 scopus 로고
    • Gold dissolution in iodide electrolytes
    • Davis A., Tran T. Gold dissolution in iodide electrolytes. Hydrometallurgy 1991, 26:163-177.
    • (1991) Hydrometallurgy , vol.26 , pp. 163-177
    • Davis, A.1    Tran, T.2
  • 33
    • 84904893901 scopus 로고    scopus 로고
    • Chloride ion interactions with oxide-covered aluminum leading to pitting corrosion: a review
    • Natishan P.M., O'Grady W.E. Chloride ion interactions with oxide-covered aluminum leading to pitting corrosion: a review. J. Electrochem. Soc. 2014, 161(9):C421-C432.
    • (2014) J. Electrochem. Soc. , vol.161 , Issue.9 , pp. C421-C432
    • Natishan, P.M.1    O'Grady, W.E.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.