Degradation and failure mechanisms in thermally exposed Au-Al ball bonds

Journal of Materials Research

Volumn 19, Issue 5, 2004, Pages 1374-1386

  Noolu, Naren J ^a   Murdeshwar, Nikhil M ^b   Ely, Kevin J ^c   Lippold, John C ^a   Baeslack III, William A ^d  

^a OHIO STATE UNIVERSITY   (United States)

^b Kulicke and Soffa   (United States)

^c EDISON WELDING INSTITUTE   (United States)

^d RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CALCULATIONS; CRACK PROPAGATION; DEGRADATION; FAILURE (MECHANICAL); INTERMETALLICS; MICROSTRUCTURE; PHASE TRANSITIONS; SCANNING ELECTRON MICROSCOPY; SHRINKAGE; STRESS CONCENTRATION; THERMAL EFFECTS;

BALL BONDS; CRAVITY GROWTH; REACTION ZONE; SHRINKAGE STRESSES; VOID LINE; VOLUMETRIC SHRINKAGE;

GOLD ALLOYS;

EID: 3142733017     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0184     Document Type: Article

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