Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy

Materials Characterization

Volumn 59, Issue 10, 2008, Pages 1419-1424

  Ji, Hongjun ^a,c   Li, Mingyu ^a   Kim, Jong Myung ^b   Kim, Dae Won ^b   Wang, Chunqing ^c  

^a University Town of Shenzhen   (China)

^b Jeonnam Provincial College   (South Korea)

^c HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Cyclic vibration; Diffusion; Nanostructure; Ultrasonic wedge bonding

Indexed keywords

ELECTRON MICROSCOPES; HIGH RESOLUTION ELECTRON MICROSCOPY; MATERIALS SCIENCE; PHASE INTERFACES; ULTRASONICS;

BOND INTERFACE; CYCLIC VIBRATION; DIFFUSION; INTERMETALLIC PHASE; NANO FEATURES; NANO SCALING; NANOSTRUCTURE; ULTRASONIC WEDGE BONDING; WEDGE BONDING;

HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY;

EID: 50149114962     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2008.01.001     Document Type: Article

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