Bromine- and chlorine-induced degradation of gold-aluminum bonds

Journal of Electronic Materials

Volumn 33, Issue 10, 2004, Pages 1111-1117

  Lue, Min Hsien ^a   Huang, Chen Town ^a   Huang, Sheng Tzung ^a   Hsieh, Ker Chang ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Halide degradation; Reliability; Wire bonding

Indexed keywords

ALUMINUM; CHEMICAL BONDS; CHLORINE; CORROSION; DEGRADATION; INTERMETALLICS; REACTION KINETICS; THIN FILMS;

ELECTRON PROBE MICROANALYZERS (EPMA); HALIDE DEGRADATION; WIRE BONDING;

BROMINE;

EID: 7044223209     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0112-z     Document Type: Conference Paper

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