Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system integration

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Klengel, R ^a   Bennemann, S ^a   Schischka, J ^a   Grosse, C ^a   Petzold, M ^a  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

Failure analysis; Reliability; Wire bonding

Indexed keywords

CORROSION PROCESS; FINE PITCH; LOCK-IN; MICROELECTRONIC SYSTEMS; MICROSTRUCTURAL INVESTIGATION; MICROSTRUCTURE INVESTIGATIONS; NON DESTRUCTIVE; NONDESTRUCTIVE METHODS; PHYSICAL FAILURE ANALYSIS; PHYSICS OF FAILURES; ROOT CAUSE; SEM; TARGET PREPARATION; TEM; TIME-OF-FLIGHT SECONDARY ION MASS SPECTROSCOPY; ULTRA-HIGH; WIRE BONDING; WIRE BONDS; X RAY INSPECTION;

ELECTRONICS PACKAGING; FAILURE MODES; FOCUSED ION BEAMS; HIGH RESOLUTION ELECTRON MICROSCOPY; IONS; MICROELECTRONICS; RELIABILITY ANALYSIS; REMOTE SENSING; SAFETY FACTOR; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SURFACE CHEMISTRY; TRANSMISSION ELECTRON MICROSCOPY; WIRE;

QUALITY ASSURANCE;

EID: 70449775442     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Harman: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield; Mcgraw-Hill Publ.Comp.; Edition 2. (Aug. 1997)
2. Zschech: Bondkontakte; Edition 1, Akademie-Verlag Berlin, 1990
3. th International Symposium for Testing and Failure Analysis 2008 (ISTFA2008)
4. Klengel et. al.: Micro structure analysis for thermosonic bonded Au wire and ultrasonic bonded Al coated Au wire; IMAPS and SEMI Wire Bonding Workshop, San Francisco 2008
5. Lue et. al.: Bromine- and Chlorine-Induced Degradation of Gold-Aluminum Bonds; Journal of Electronic Materials , Oct. 2004