Thermal characterization of thin film Cu interconnects for the next generation of microelectronic devices

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 575-583

  Shojaei Zadeh, Shahab ^a   Zhang, Shu ^a   Liu, Wenjun ^a   Yang, Yizhang ^a   Sadeghipour, Sadegh M ^a   Asheghi, Mehdi ^a   Sverdrup, Per ^b,c  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b STANFORD UNIVERSITY   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Copper lines; Electrical resistivity; Interconnects; Thermal conductivity; Ultra thin copper films

Indexed keywords

COPPER LINES; FOCUSED ION BEAMS (FIB); INTERCONNECTS; ULTRATHIN COPPER FILMS;

COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC LINES; ION BEAMS; MICROELECTRONICS; THERMAL CONDUCTIVITY; THICK FILMS; TRANSISTORS; ULTRATHIN FILMS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 4444379991     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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