-
1
-
-
77957765642
-
Printed electronics: The challenges involved in printing devices, interconnects, and contacts based on inorganic materials
-
J. Perelaer, P.J. Smith, D. Mager, D. Soltman, S.K. Volkman, V. Subramanian, J.G. Korvink, and U.S. Schubert Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials J. Mater. Chem. 20 2010 8446
-
(2010)
J. Mater. Chem.
, vol.20
, pp. 8446
-
-
Perelaer, J.1
Smith, P.J.2
Mager, D.3
Soltman, D.4
Volkman, S.K.5
Subramanian, V.6
Korvink, J.G.7
Schubert, U.S.8
-
2
-
-
72149129172
-
Sintering of inkjet printed copper nanoparticles for flexible electronics
-
S. Jang, Y. Seo, J. Choi, T. Kim, J. Cho, S. Kim, and D. Kim Sintering of inkjet printed copper nanoparticles for flexible electronics Scr. Mater. 62 2010 258
-
(2010)
Scr. Mater.
, vol.62
, pp. 258
-
-
Jang, S.1
Seo, Y.2
Choi, J.3
Kim, T.4
Cho, J.5
Kim, S.6
Kim, D.7
-
3
-
-
78049529967
-
Inkjet printed electronics using copper nanoparticle ink
-
J.S. Kang, H.S. Kim, J. Ryu, H.T. Hahn, S. Jang, and J.W. Joung Inkjet printed electronics using copper nanoparticle ink J. Mater. Sci. Mater. Electron. 21 2010 1213
-
(2010)
J. Mater. Sci. Mater. Electron.
, vol.21
, pp. 1213
-
-
Kang, J.S.1
Kim, H.S.2
Ryu, J.3
Hahn, H.T.4
Jang, S.5
Joung, J.W.6
-
4
-
-
41149125568
-
Controlling the thickness of the surface oxide layer on cu nanoparticles for the fabrication on conductive structures by ink-jet printing
-
S. Jeong, K. Woo, D. Kim, S. Lim, J.S. Kim, H. Shin, Y. Xia, and J. Moon Controlling the thickness of the surface oxide layer on cu nanoparticles for the fabrication on conductive structures by ink-jet printing Adv. Funct. Mater. 18 2008 679
-
(2008)
Adv. Funct. Mater.
, vol.18
, pp. 679
-
-
Jeong, S.1
Woo, K.2
Kim, D.3
Lim, S.4
Kim, J.S.5
Shin, H.6
Xia, Y.7
Moon, J.8
-
5
-
-
65549113852
-
Formation of air-stable copper-silver core-shell nanoparticles for inkjet printing
-
M. Grouchko, A. Kamyshny, and S. Magdassi Formation of air-stable copper-silver core-shell nanoparticles for inkjet printing J. Mater. Chem. 19 2009 3057
-
(2009)
J. Mater. Chem.
, vol.19
, pp. 3057
-
-
Grouchko, M.1
Kamyshny, A.2
Magdassi, S.3
-
6
-
-
0034251006
-
Inkjet printed copper source/drain metallization for amorphous silicon thin-film transistors
-
C.M. Hong, and S. Wagner Inkjet printed copper source/drain metallization for amorphous silicon thin-film transistors IEEE Electron Device Lett. 21 2000 384
-
(2000)
IEEE Electron Device Lett.
, vol.21
, pp. 384
-
-
Hong, C.M.1
Wagner, S.2
-
7
-
-
77951883112
-
Inkjet-printed Cu source/drain electrodes for solution-deposited thin film transistors
-
K. Woo, C. Bae, Y. Jeong, D. Kim, and J. Moon Inkjet-printed Cu source/drain electrodes for solution-deposited thin film transistors J. Mater. Chem. 20 2010 3877
-
(2010)
J. Mater. Chem.
, vol.20
, pp. 3877
-
-
Woo, K.1
Bae, C.2
Jeong, Y.3
Kim, D.4
Moon, J.5
-
8
-
-
84860764808
-
Copper nanoparticles for printed electronics: Routs towards achieving oxidation stability
-
S. Magdassi, M. Grouchko, and A. Kamyshny Copper nanoparticles for printed electronics: routs towards achieving oxidation stability Materials 3 2010 4626
-
(2010)
Materials
, vol.3
, pp. 4626
-
-
Magdassi, S.1
Grouchko, M.2
Kamyshny, A.3
-
9
-
-
77957871880
-
Effect of complex agent on characteristics of copper conductive pattern formed by ink-jet printing
-
(4 p)
-
Y.-I. Lee, K.-J. Lee, Y.-S. Goo, N.-W. Kim, Y. Byun, J.-D. Kim, B. Yoo, and Y.-H. Choa Effect of complex agent on characteristics of copper conductive pattern formed by ink-jet printing Jpn. J. Appl. Phys. 49 2010 086501 (4 p)
-
(2010)
Jpn. J. Appl. Phys.
, vol.49
, pp. 086501
-
-
Lee, Y.-I.1
Lee, K.-J.2
Goo, Y.-S.3
Kim, N.-W.4
Byun, Y.5
Kim, J.-D.6
Yoo, B.7
Choa, Y.-H.8
-
10
-
-
78649940483
-
Ink-jet printing of Cu conductive ink on flexible substrate modified by oxygen plasma treatment
-
Y.-S. Goo, Y.-I. Lee, N. Kim, K.-J. Lee, B. Yoo, S.-J. Hong, J.-D. Kim, and Y.-H. Choa Ink-jet printing of Cu conductive ink on flexible substrate modified by oxygen plasma treatment Surf. Coat. Technol. 205 2010 S369
-
(2010)
Surf. Coat. Technol.
, vol.205
, pp. 369
-
-
Goo, Y.-S.1
Lee, Y.-I.2
Kim, N.3
Lee, K.-J.4
Yoo, B.5
Hong, S.-J.6
Kim, J.-D.7
Choa, Y.-H.8
-
11
-
-
84893674812
-
Copper carboxylate with different carbon chain lengths as metal-organic decomposition ink
-
D. Deng, T. Qi, Y. Cheng, Y. Jin, and F. Xiao Copper carboxylate with different carbon chain lengths as metal-organic decomposition ink J. Mater. Sci. 25 2014 390
-
(2014)
J. Mater. Sci.
, vol.25
, pp. 390
-
-
Deng, D.1
Qi, T.2
Cheng, Y.3
Jin, Y.4
Xiao, F.5
-
12
-
-
0346034855
-
Patterned low temperature copper-rich deposits using inkjet printing
-
G.G. Rozenberg, E. Bresler, S.P. Speakman, C. Jeynes, and J. Steinke Patterned low temperature copper-rich deposits using inkjet printing Appl. Phys. Lett. 81 2002 5249
-
(2002)
Appl. Phys. Lett.
, vol.81
, pp. 5249
-
-
Rozenberg, G.G.1
Bresler, E.2
Speakman, S.P.3
Jeynes, C.4
Steinke, J.5
-
13
-
-
77952518604
-
Inkjet printing of conductive silver patterns by using the first aqueous particle-free MOD ink without additional stabilizing ligands
-
S.F. Jahn, T. Blaudeck, R.R. Baumann, A. Jakob, P. Ecorchard, T. Rüffer, H. Lang, and P. Schmidt Inkjet printing of conductive silver patterns by using the first aqueous particle-free MOD ink without additional stabilizing ligands Chem. Mater. 22 2010 3067
-
(2010)
Chem. Mater.
, vol.22
, pp. 3067
-
-
Jahn, S.F.1
Blaudeck, T.2
Baumann, R.R.3
Jakob, A.4
Ecorchard, P.5
Rüffer, T.6
Lang, H.7
Schmidt, P.8
-
14
-
-
84875409342
-
Particle-free gold metal-organic decomposition ink for inkjet printing of gold structures
-
C. Schoner, A. Tuchscherer, T. Blaudeck, S.F. Jahn, R.R. Baumann, and H. Lang Particle-free gold metal-organic decomposition ink for inkjet printing of gold structures Thin Solid Films 531 2013 147
-
(2013)
Thin Solid Films
, vol.531
, pp. 147
-
-
Schoner, C.1
Tuchscherer, A.2
Blaudeck, T.3
Jahn, S.F.4
Baumann, R.R.5
Lang, H.6
-
15
-
-
84879955450
-
A straightforward approach to oxide-free copper nanoparticles by thermal decomposition of a copper(I) precursor
-
D. Adner, M. Korb, S. Schulze, M. Hietschold, and H. Lang A straightforward approach to oxide-free copper nanoparticles by thermal decomposition of a copper(I) precursor Chem. Commun. 49 2013 6855
-
(2013)
Chem. Commun.
, vol.49
, pp. 6855
-
-
Adner, D.1
Korb, M.2
Schulze, S.3
Hietschold, M.4
Lang, H.5
-
16
-
-
84886420681
-
Copper(II) and triphenylphosphine copper(I) ethylene glycol carboxylates: Synthesis, characterisation and copper nanoparticle generation
-
D. Adner, S. Möckel, M. Korb, R. Buschbeck, T. Rüffer, S. Schulze, L. Mertens, M. Hietschold, M. Mehring, and H. Lang Copper(II) and triphenylphosphine copper(I) ethylene glycol carboxylates: synthesis, characterisation and copper nanoparticle generation Dalton Trans. 42 2013 15599
-
(2013)
Dalton Trans.
, vol.42
, pp. 15599
-
-
Adner, D.1
Möckel, S.2
Korb, M.3
Buschbeck, R.4
Rüffer, T.5
Schulze, S.6
Mertens, L.7
Hietschold, M.8
Mehring, M.9
Lang, H.10
-
17
-
-
84856368982
-
Comparative studies on thermal and laser sintering for highly conductive Cu films printable on plastic substrate
-
M. Joo, B. Lee, S. Jeong, and M. Lee Comparative studies on thermal and laser sintering for highly conductive Cu films printable on plastic substrate Thin Solid Films 520 2012 2878
-
(2012)
Thin Solid Films
, vol.520
, pp. 2878
-
-
Joo, M.1
Lee, B.2
Jeong, S.3
Lee, M.4
-
18
-
-
85001163723
-
Relationships between the carbon-oxygen stretching frequencies of carboxylato complexes and the type of carboxylate coordination
-
G.B. Deacon, and P.J. Phillips Relationships between the carbon-oxygen stretching frequencies of carboxylato complexes and the type of carboxylate coordination Coord. Chem. Rev. 33 1980 227
-
(1980)
Coord. Chem. Rev.
, vol.33
, pp. 227
-
-
Deacon, G.B.1
Phillips, P.J.2
-
19
-
-
0035966450
-
Diaquabis(3,6-dioxaheptanoato)copper(II): Crystal structure and EPR characteristics
-
J. Fawcett, S.H. Laurie, C. Simpson, M.C.R. Symons, F.A. Taiwo, and I. Hawkins Diaquabis(3,6-dioxaheptanoato)copper(II): crystal structure and EPR characteristics Inorg. Chim. Acta 312 2001 245
-
(2001)
Inorg. Chim. Acta
, vol.312
, pp. 245
-
-
Fawcett, J.1
Laurie, S.H.2
Simpson, C.3
Symons, M.C.R.4
Taiwo, F.A.5
Hawkins, I.6
-
20
-
-
37049127717
-
Crystal structures of copper(II) α-hydroxy- and α-alkoxy-carboxylates
-
J.G. Forrest, C.K. Prout, and F.J.C. Rossotti Crystal structures of copper(II) α-hydroxy- and α-alkoxy-carboxylates Chem. Commun. 1966 658
-
(1966)
Chem. Commun.
, pp. 658
-
-
Forrest, J.G.1
Prout, C.K.2
Rossotti, F.J.C.3
-
21
-
-
84863076080
-
Highly conductive polymer-decorated Cu electrode films printed on substrates with novel precursor-based inks and pastes
-
Y.-H. Choi, J. Lee, S.J. Kim, D.-H. Yeon, and Y. Byun Highly conductive polymer-decorated Cu electrode films printed on substrates with novel precursor-based inks and pastes J. Mater. Chem. 22 2012 3624
-
(2012)
J. Mater. Chem.
, vol.22
, pp. 3624
-
-
Choi, Y.-H.1
Lee, J.2
Kim, S.J.3
Yeon, D.-H.4
Byun, Y.5
-
22
-
-
34547596792
-
Direct writing of copper conductive patterns by ink-jet printing
-
B.K. Park, D. Kim, S. Jeong, J. Moon, and J.S. Kim Direct writing of copper conductive patterns by ink-jet printing Thin Solid Films 515 2007 7706
-
(2007)
Thin Solid Films
, vol.515
, pp. 7706
-
-
Park, B.K.1
Kim, D.2
Jeong, S.3
Moon, J.4
Kim, J.S.5
-
23
-
-
84856376673
-
Effect of copper concentration in printable copper inks on film fabrication
-
S.J. Kim, J. Lee, Y.-H. Choi, D.-H. Yeon, and Y. Byun Effect of copper concentration in printable copper inks on film fabrication Thin Solid Films 520 2012 2731
-
(2012)
Thin Solid Films
, vol.520
, pp. 2731
-
-
Kim, S.J.1
Lee, J.2
Choi, Y.-H.3
Yeon, D.-H.4
Byun, Y.5
-
24
-
-
84877699998
-
Rapid low-pressure plasma sintering of inkjet-printed silver nanoparticles for RFID antennas
-
F.M. Wolf, J. Perelaer, S. Stumpf, D. Bollen, F. Kriebel, and U.S. Schubert Rapid low-pressure plasma sintering of inkjet-printed silver nanoparticles for RFID antennas J. Mater. Res. 28 2013 1254
-
(2013)
J. Mater. Res.
, vol.28
, pp. 1254
-
-
Wolf, F.M.1
Perelaer, J.2
Stumpf, S.3
Bollen, D.4
Kriebel, F.5
Schubert, U.S.6
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