Inkjet printing of a pH sensitive palladium catalyst patterns of ITO glass for electroless copper

Surface and Coatings Technology

Volumn 259, Issue PB, 2014, Pages 340-345

  Wang, Min Wen ^a   Liu, Tsai Yun ^a   Pang, Da Chen ^a   Hung, Jung Chou ^b   Tseng, Chun Chieh ^c  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

^b FENG CHIA UNIVERSITY   (Taiwan)

^c METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE   (Taiwan)

Author keywords

Electroless plating; Ink jet printing; Palladium nanoparticles

Indexed keywords

ADHESION; ALKALINITY; CATALYSTS; CHITIN; CHITOSAN; COPOLYMERS; DEPOSITION; ELECTROLESS PLATING; INK; ITO GLASS; METAL IONS; METAL NANOPARTICLES; NANOPARTICLES; PALLADIUM; PH SENSORS; PLATING; POLYVINYL ACETATES; PRECIOUS METALS; SOLAR CELLS; SUBSTRATES; TIN OXIDES;

ELECTROLESS COPPER; ENHANCED ADHESIONS; INDIUM-TIN-OXIDE GLASS SUBSTRATES; PALLADIUM NANOPARTICLES; PH-SENSITIVE COPOLYMERS; POLYVINYL ACETATES (PVAC); POSITIVELY CHARGED; SUBSTRATE TEMPERATURE;

INK JET PRINTING;

EID: 84923503232     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2014.02.031     Document Type: Article

References (18)

1. Nguyen B.T., Gautrot J.E., Nguyen M.T., Zhu X.X. J. Mater. Chem. 2007, 17:1725.
2. Dearden A.L., Smith P.J., Shin D.Y., Reis N., Derby B., Brien P.O. Macromol. Rapid Commun. 2005, 26:315.
3. Lu C.A., Lin P., Lin H.C., Wang S.F. J. Appl. Phys. 2007, 46:251.
4. van Osch T.H.J., Perelaer J., de Laat A.W.M., Schubert U.S. Adv. Mater. 2008, 20:343.
5. Lee H.H., Chou K.S., Huang K.C. Nanotechnology 2005, 16:2436.
6. Alexander K., Matti B.M., Shai A., Shlomo M. Macromol. Rapid Commun. 2005, 26:281.
7. Ko S.H., Pan H., Grigoropoulos C.P., Luscombe C.K., chet Fred J.M.J., Poulikakos D. Nanotechnology 2007, 18:345202.
8. Perelaer J., Hendriks C.E., de Laat A.W.M., Schubert U.S. Nanotechnology 2009, 20:165303.
9. Shah P., Kevrekidis Y., Benziger J. Langmuir 1999, 15:1584.
10. Kao C.Y., Chou K.S. Electrochem. Solid-State Lett. 2007, 10(3):D32.
11. Liu Y.M., Pu N.W., Chen W.D., Lin K.H., Sung Y., Ger M.D., Chang C.L., Tseng T.L. Microelectron. Reliab. 2012, 52:398.
12. Jeong J.A., Kim H.K. Sol. Energy Mater. Sol. Cells 2009, 93:1801.
13. Choi K.H., Kim J.Y., Lee Y.S., Kim H.J. Thin Solid Films 1999, 341:152.
14. Zou J., Yip H.-L., Hau S.K., Jen A.K.Y. Appl. Phys. Lett. 2010, 96:203301.
15. Tseng C.C., Lin Y., Liu T.Y., Nian Y.Y., Wang M.W., Ger M.D. Thin Solid Films 2013, 536:81.
16. Park J., Moon J. Langmuir 2006, 22:3506.
17. Lee B., Kim Y., Yang S., Jeong I., Moon J. Curr. Appl. Phys. 2009, 9:157.
18. Barnat E.V., Nagakura D., Wang P.I., Lu T.M. J. Appl. Phys. 2002, 91:1667.