Low temperature fabrication of Ni-P metallic patterns on ITO substrates utilizing inkjet printing

Microelectronics Reliability

Volumn 52, Issue 2, 2012, Pages 398-404

  Liu, Yih Ming ^a   Pu, Nen Wen ^b   Chen, Wen Ding ^a   Lin, Kun Hong ^a   Sung, Yuh ^c   Ger, Ming Der ^a   Chang, Ching Liang ^c   Tseng, Te Liand ^c  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b YUAN ZE UNIVERSITY   (Taiwan)

^c CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BACK ELECTRODE; CATALYTIC SITES; DEPOSITION TIME; HIGH RESOLUTION; INDIUM TIN OXIDE SUBSTRATES; LOW-TEMPERATURE FABRICATION; LOW-TEMPERATURE PROCESS; METAL LINE; METALLIC LINES; METALLIC PATTERNS; NI-P COATING; OPTICAL MICROSCOPES; OPTIMUM PARAMETERS; RING EFFECT; SCOTCH TAPE TEST; SUBSTRATE TEMPERATURE; THERMO SENSITIVE;

ADHESION; DROPS; ELECTROLESS PLATING; INDIUM COMPOUNDS; INK JET PRINTING; PALLADIUM; STYRENE; TIN; TIN OXIDES;

SUBSTRATES;

EID: 84855907212     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.07.008     Document Type: Article

References (25)

1. Elmqvist R. US patent no. 256643; 1951.
2. J.W. Kang, W.I. Jeong, J.J. Kim, H.K. Kim, D.G. Kim, and G.H. Lee Electrochem Solid-State Lett 10 2007 75
3. K.F. Teng, and R.W. Vest IEEE Trans Comp Hybrids Manuf Technol 11 1998 291 297
4. F. Loffredo, G. Burrasca, L. Quercia, and D. Sala Macromol Symp 109 2007 357 363
5. T.H.J. van Osch, J. Perelaer, A.W.M. de Laat, and U.S. Schubert Adv Mater 20 2008 343 345
6. Y. Galagan, J.-E.J.M. Rubingh, R. Andriessen, C.-C. Fan, P.W.M. Blom, and S.C. Veenstra Sol Energy Mater Sol Cells 95 2011 1339 1343
7. V.A. Chaudhari, and C.S. Solanki Sol Energy Mater Sol Cells 94 2010 2094 2101
8. M.K. Kwak, K.H. Shin, E.Y. Yoon, and K.Y. Suh J Colloid Interface Sci 343 2010 301 305
9. B.H. Ryu, Y. Choi, H.S. Park, J.H. Byun, K. Kong, and J.O. Lee Colloid Surf A - Physicochem Eng Asp 270-271 2005 345 351
10. D.V. Goia, and E. Matijevic New J Chem 22 1998 1203 1215
11. B.L. Cushing, V.L. Kolesnichenko, and C.J. O' Connor Chem Rev 104 2004 3893 3946
12. C. Burda, X. Chen, R. Narayanan, and M.A. EI-Sayed Chem Rev 105 2005 1025 1102
13. W. Cui, W. Lu, Y. Zhang, G. Lin, T. Wei, and L. Jiang Colloid Surf A - Physicochem Eng Asp 358 2010 35 41
14. S. Jang, Y. Seo, J. Choi, T. Kim, J. Cho, and S. Kim Scr Mater 62 2010 258 261
15. Z. Wang, W. Wu, Q. Yang, Y. Li, and C.H. Nohc J Alloys Compd 486 2009 706 710
16. A. Pokaipisit, M. Horprathum, and P. Limsuwan Kasetsart J (Nat Sci) 42 2008 362 366
17. P. Shah, Y. Kevrekidis, and J. Benziger Langmuir 15 1999 1584 1587
18. T.F. Guo, S.C. Chang, S. Pyo, and Y. Yang Langmuir 18 2002 8142 8147
19. K. Cheng, M.H. Yang, W.W. Chiu, C.Y. Huang, J. Chang, and Y.F. Ying Macromol Raipid Commun 26 2005 247 264
20. W.D. Chen, Y. Sung, C.P. Chang, Y.C. Chen, and M.D. Ger Surf Coat Technol 204 2010 2130 2135
21. B.J. de Gans, and U.S. Schubert Macromol Rapid Commun 24 2003 659
22. J.L. Ou, C.P. Chang, Y. Sung, K.L. Ou, C.C. Tseng, and H.W. Ling Colloids Surf, A Physcicochem Eng Asp 305 2007 36 41
23. C.C. Tseng, C.P. Chang, J.L. Ou, Y. Sung, and M.D. Ger Colloids Surf, A Physcicochem Eng Asp 333 2009 138 144
24. C.P. Chang, C.C. Tseng, J.L. Ou, W.H. Hwu, and M.D. Ger Colloid Polym Sci 288 2010 395 403
25. W.D. Chen, C.P. Chang, Y. Sung, Y.M. Liu, and M.D. Ger Surf Coat Technol 205 2011 4750 4756