Self-healing Ag/epoxy electrically conductive adhesive using encapsulated epoxy-amine healing chemistry

Journal of Applied Polymer Science

Volumn 132, Issue 7, 2015, Pages

  Tao, Yu ^a,b   Chang, Yu ^a   Tao, Yuxiao ^b   Wu, Haiping ^b   Yang, Zhenguo ^a  

^a FUDAN UNIVERSITY   (China)

^b CHANGZHOU UNIVERSITY   (China)

Author keywords

adhesives; composites; thermosets

Indexed keywords

COMPOSITE MATERIALS; MICROSTRUCTURE; SELF-HEALING MATERIALS; THERMOSETS;

BULK RESISTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVES; EPOXY AMINE; MECHANICAL AND ELECTRICAL PROPERTIES; MICROCAPSULES; OPTIMAL LOADING; SELF-HEALING; WEIGHT RATIOS;

ADHESIVES;

EID: 84922896906     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.41483     Document Type: Article

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