Study on the effects of adipic acid on properties of dicyandiamide-cured electrically conductive adhesive and the interaction mechanism

Journal of Electronic Materials

Volumn 43, Issue 1, 2014, Pages 132-136

  Wang, Ling ^a,b   Wan, Chao ^b   Fu, Yonggao ^b   Chen, Hongtao ^a   Liu, Xiaojian ^a   Li, Mingyu ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b China National Electric Apparatus Research Institute   (China)

Author keywords

adipic acid; bulk resistivity; dicyandiamide; Electrically conductive adhesive (ECA); shear strength; thermal conductivity

Indexed keywords

ACIDIC FUNCTIONAL GROUPS; ADIPIC ACIDS; BULK RESISTIVITY; DICYANDIAMIDE; ELECTRICAL CONDUCTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVES; INTERACTION MECHANISMS; MECHANISM OF ACTION;

COUPLING AGENTS; ELECTRIC CONDUCTIVITY; FUNCTIONAL GROUPS; MECHANICAL PROPERTIES; POWER ELECTRONICS; SHEAR STRENGTH; SILVER; THERMAL CONDUCTIVITY;

CURING;

EID: 84891785695     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2765-y     Document Type: Article

References (16)

1. L. Yi, K.S. Moon, and C.P. Wong, Science, 308, 5727 (2005).
2. J.S. Hwang, Environment-Friendly Electronics: Lead-Free Technology (Port Erin, 2001), pp. 4-10.
3. J. Lau, C.P. Wong, N.-C. Lee, and R. Lee, Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive Adhesive Materials (New York, 2002), pp. 18.1-18.18.
4. Y. Li and C.P. Wong, Mater. Sci. Eng. R: Reports 51, 1 (2006).
5. H. Li, K.-S. Moon, and C.P. Wong, J. Electron. Mater. 33, 2 (2004).
6. F. Tan, X. Qiao, J. Chen, and H. Wang, Int. J. Adhes. Adhes. 26, 6 (2006).
7. R. Zhang, W. Lin, K. Lawrence, and C.P. Wong, Int. J. Adhes. Adhes. 30, 6 (2010).
8. Y. Li, K.-S. Moon, A. Whitman, and C.P. Wong, IEEE Trans. Compon. Packag. Technol. 29, 4 (2006).
9. D. Chen, X. Qiao, X. Qiu, F. Tan, J. Chen, and R. Jiang, J. Mater. Sci. Mater. Electron. 21, 5 (2010).
10. L. Yi, K.S. Moon, and C.P. Wong, IEEE Trans. Compon. Packag. Technol. 29, 1 (2006).
11. S. Liong and C.P. Wong, Pro. Electronic Components and Technology Int. Conf, ECTC2001
12. S. Liong, C.P. Wong, and W.F. Burgoyne Jr., Pro. Electronic Components and Technology Int. Conf. ECTC2002.
13. R.R. Gomatam and E. Sancaktar, J. Adhes. Sci. Technol. 18, 7 (2004).
14. D. Lu, Q.K. Tong, and C.P. Wong, IEEE Trans. Electron. Packag. 22, 3 (1999).
15. X. Lin, Q. Li, and J. Zhang, Proc. Electronic Materials and Packaging Int. Conf, EMAP 2006.
16. L.H. Dubois, B.R. Zegarski, and R.G. Nuzzo, Langmuir. 2, 4 (1986).