SCOPUS 정보 검색 플랫폼

Volumn 26, Issue 43, 2014, Pages 7371-7377

Biodegradable materials for multilayer transient printed circuit boards

(7) Huang, Xian a,b Liu, Yuhao a Hwang, Suk Won a Kang, Seung Kyun a Patnaik, Dwipayan a Cortes, Jonathan Fajardo a Rogers, John A a

a University of Illinois at Urbana Champaign (United States)

b University of Missouri Rolla (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY HARVESTING; MULTILAYERS; NEAR FIELD COMMUNICATION; SCREEN PRINTING; TIMING CIRCUITS;

BIODEGRA-DABLE MATERIALS; COMMERCIAL ELECTRONICS; ELECTRICAL INTERCONNECTIONS; ENVIRONMENTAL CONDITIONS; MULTILAYER CONFIGURATION; PRINTED CIRCUIT BOARDS (PCB); SCREEN PRINTING METHODS; THE NEAR FIELD COMMUNICATION (NFC);

PRINTED CIRCUIT BOARDS;

BIODEGRADABLE PLASTIC; METAL; WATER;

CHEMISTRY; ELECTRIC CONDUCTIVITY; ELECTRICAL EQUIPMENT; EQUIPMENT DESIGN; PRINTING; PROCEDURES; SCANNING ELECTRON MICROSCOPY; TEMPERATURE; WIRELESS COMMUNICATION;

BIODEGRADABLE PLASTICS; ELECTRIC CONDUCTIVITY; ELECTRICAL EQUIPMENT AND SUPPLIES; EQUIPMENT DESIGN; METALS; MICROSCOPY, ELECTRON, SCANNING; PRINTING; TEMPERATURE; WATER; WIRELESS TECHNOLOGY;

EID: 84922223075 PISSN: 09359648 EISSN: 15214095 Source Type: Journal
DOI: 10.1002/adma.201403164 Document Type: Article

Times cited : (147)

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