Materials and fabrication processes for transient and bioresorbable high-performance electronics

Advanced Functional Materials

Volumn 23, Issue 33, 2013, Pages 4087-4093

  Hwang, Suk Won ^a   Kim, Dae Hyeong ^b   Tao, Hu ^c   Kim, Tae Il ^a,d   Kim, Stanley ^a   Yu, Ki Jun ^a   Panilaitis, Bruce ^c   Jeong, Jae Woong ^a   Song, Jun Kyul ^e   Omenetto, Fiorenzo G ^c   Rogers, John A ^a,e  

^a University of Illinois at Urbana Champaign   (United States)

^b Seoul National University   (South Korea)

^c Tufts University   (United States)

^d Sungkyunkwan University   (South Korea)

^e UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

biocompatible electronics; bioresorbable electronics; fully formed electronic devices; transient electronics

Indexed keywords

BIORESORBABLE; CONVENTIONAL MICROELECTRONICS; ELECTRICAL CHARACTERISTIC; ELECTRONIC DEVICE; FABRICATION PROCEDURE; SILICON ON INSULATOR WAFERS; SILICON WAFER SUBSTRATES; TRANSIENT ELECTRONICS;

BIOCOMPATIBILITY; ELECTRIC PROPERTIES; MAGNESIUM; MICROELECTRONICS; SEMICONDUCTOR DEVICES; THERMOELECTRIC EQUIPMENT;

SILICON WAFERS;

EID: 84883563858     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201300127     Document Type: Article

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