SCOPUS 정보 검색 플랫폼

Volumn 7, Issue 11, 2014, Pages 3674-3682

Future paper based printed circuit boards for green electronics: Fabrication and life cycle assessment

(10) Liu, Jingping a Yang, Cheng a Wu, Haoyi a Lin, Ziyin b Zhang, Zhexu a Wang, Ronghe a Li, Baohua a Kang, Feiyu a Shi, Lei a Wong, Ching Ping b

a TSINGHUA UNIVERSITY (China)

b Georgia Institute of Technology (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARTIFICIAL LIFE; ENVIRONMENTAL IMPACT; GLOBAL WARMING; GREEN MANUFACTURING; LIFE CYCLE; OZONE LAYER; PAPER; SUSTAINABLE DEVELOPMENT; TIMING CIRCUITS;

GLOBAL WARMING POTENTIAL; IMPACT ON THE ENVIRONMENT; LIFE CYCLE ASSESSMENT (LCA); MECHANICAL FLEXIBILITY; MULTILAYER PRINTED CIRCUIT BOARD; OZONE LAYER DEPLETION; PREPARATION PROCESS; QUANTITATIVE STUDY;

PRINTED CIRCUIT BOARDS;

ELECTRONIC EQUIPMENT; ENVIRONMENTAL IMPACT; LIFE CYCLE ANALYSIS; OPTIMIZATION; QUANTITATIVE ANALYSIS;

EID: 84907970865 PISSN: 17545692 EISSN: 17545706 Source Type: Journal
DOI: 10.1039/c4ee01995d Document Type: Article

Times cited : (151)

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