Paper-based nanosilver conductive ink

Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 2, 2013, Pages 628-634

  Yang, Wendong ^a   Liu, Chunyan ^a   Zhang, Zhiying ^a   Liu, Yun ^a   Nie, Shidong ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

FATTY ACIDS; METAL NANOPARTICLES; SINTERING; SOLAR ENERGY; SYNTHESIS (CHEMICAL);

CONDUCTIVE INK; CONDUCTIVE MECHANISMS; DODECANOIC ACID; DOMINATING FACTORS; HIGH CONDUCTIVITY; LOW SINTERING TEMPERATURE; PARTICLE CONTACTS; SILVER NANO INKS;

SILVER NANOPARTICLES;

EID: 84878614129     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-012-0777-7     Document Type: Article

References (30)

1. Y. Chen, J. Au, P. Kazlas, A. Ritenour, H. Gate, M. McCreary, Nature 423, 136 (2003)
2. C.N. Hoth, S.A. Choulis, P. Schilinsky, C.J. Brabec, Adv. Mater. 19, 3973 (2007)
3. T. Okimoto, K. Takenobu, Y. Yanagi, H. Miyata, H. Shimotani, Y. Kataura, Iwasa, Adv. Mat 22, 3981 (2010)
4. V. Subramanian, J.M.J. Frechet, P.C. Chang, D. Huang, J.B. Lee, S.E. Molesa, A.R. Murphy, D.R. Redinger, S.K. Volkman, Proc. IEEE 93, 1330 (2005)
5. L. Hu, J.W. Choi, Y. Yang, S. Jeong, F. La Mantia, L.F. Cui, Y. Cui, PNAS 106, 21490 (2009)
6. S.H. Lim, J.W. Kemling, L. Feng, K.S. Suslick, Analyst 134, 2453 (2009)
7. C.T. Wang, K.Y. Huang, D.T.W. Lin, Y.C. Hu, Sensors 10, 5054 (2010)
8. P. Buffat, J.P. Borel, Phys. Rev. A 13, 2287 (1976)
9. D. Kim, J. Moon, Solid State Lett. 8, J30 (2005)
10. Y. Li, Y. Wu, B.S. Ong, J. Am. Chem. Soc. 127, 3266 (2005)
11. P.A. Hu, K. Li, W.L. Chen, P. Li, D.P. Chu, W. O'Neil, J. Micromech. Microeng. 20, 075032 (2010)
12. K.J. Lee, B.H. Jun, T.H. Kim, J. Joung, Nanotechnology 17, 2424 (2006)
13. I.K. Shim, Y.I. Lee, K.J. Lee, J. Joung, Mater. Chem. Phys. 110, 316 (2008)
14. K.J. Lee, B.H. Jun, J. Choi, Y.i Lee, J. Joung, Y.S. Oh, Nanotechnology 18, 335601 (2007)
15. W.W. Yin, D.H. Lee, J. Choi, C. Park, S.M. Cho, Korean J. Chem. Eng. 25, 1358 (2008)
16. S. Jeong, H.C. Song, W.W. Lee, Y. Choi, B.H. Ryu, J. Appl. Phys. 108, 102805 (2010)
17. S. Jeong, H.C. Song, W.W. Lee, Y. Choi, S.S. Lee, B.H. Ryu, J. Phys. Chem. C 114, 22277 (2010)
18. R. Shankar, L. Groven, A. Amert, K.W. Whites, J.J. Kellar, J. Mater. Chem. 21, 10871 (2011)
19. B.Y. Ahn, D.J. Lorang, J.A. Lewis, Nanoscale 3, 2700 (2011)
20. M. Berggren, D. Nilsson, N.D. Robinson, Nat. Mater. 6, 3 (2007)
21. Y. Sun, J.A. Rogers, Adv. Mater. 19, 1897 (2007)
22. M.A.M. Leenen, V. Arning, H. Thiem, J. Steiger, R. Anselmann, Phys. Status Solidi A 206, 588 (2009)
23. D.H. Kim, Y.S. Kim, J. Wu, Z. Liu, J. Song, H.S. Kim, Y.Y. Huang, K.C. Hwang, J.A. Rogers, Adv. Mater. 21, 3703 (2009)
24. A.C. Siegel, S.T. Phillips, M.D. Dickey, N. Lu, Z. Suo, G.M. Whitesides, Adv. Funct. Mater. 20, 28 (2010)
25. A. Russo, B.Y. Ahn, J.J. Adams, E.B. Duoss, J.T. Bernhard, J.A. Lewis, Adv. Mater. 23, 3426 (2011)
26. N. Wu, L. Fu, M. Su, M. Aslam, K.C. Wong, V.P. Dravid, Nano Lett. 4, 383 (2004)
27. H.J. Jiang, K. Moon, F. Hua, C.P. Wong, Chem. Mater. 19, 4482 (2007)
28. E. Pike, C.H. Seager, Phys. Rev. B 10, 1421 (1974)
29. L.H. Fang, S. Bin, J.M. Qing, C.P. Wong, in Proceeding of 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (2004), p. 193
30. G.R. Ruschau, S. Yashikawa, R.E. Newnham, J. Appl. Phys. 72, 953 (1992)