Low-k polymers

Interlayer Dielectrics for Semiconductor Technologies

Volumn , Issue , 2003, Pages 157-199

  Murarka, S P ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; FILM PREPARATION; LOW-K DIELECTRIC; METALLIC FILMS; SILICA;

ACTUAL USE; BASIC CHARACTERISTICS; INTER-LAYER DIELECTRIC MATERIALS; INTER-LAYER DIELECTRICS; POLYMER CHEMISTRY; PREPARATION METHOD; RELATED WORKS; SURROUNDING MATERIALS;

POLYMERS;

EID: 84904027465     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1016/B978-012511221-5/50008-8     Document Type: Chapter

References (146)

1. The National Technology Roadmap for Semiconductors-Technology Needs 1997, Semiconductor Industry Association, SIA, San Jose, CA.
2. Handbook of Thin Film Technology 1970, McGraw-Hill, New York. L.I. Massiel, R. Glang (Eds.).
3. Painter P.C., Coleman M.M. Fundamentals of Polymer Science 1994, Copyright CRC Press, Boca Raton, Florida, Technology Publishing, Lancaster, PA.
4. Lai J.H., Jenekhe S.A., Jensen R.J., Roer M. Solid State Technol. 1984, 27:39.
5. Askeland D.R. The Science and Engineering of Materials 1974, PWS Publishing, Boston, MA. 3rd edn.
6. Townsend P.H., Martin S.J., Godschal J., Romer D.R., Smith D.W., Castillo D., DeVries R., Buske G., Rondan N., Froelicher S., Marshall J., Shaffer E.O., Im J.-H. Mater. Res. Soc. Symp. Proc. 1997, 476:9.
7. Treichel H., Withers B., Ruhl G., Ansmann P., Wurl R., Muller Ch., Dietlmeier M., Maier G. Handbook of Low and High Dielectric Constant Materials and Their Applications-Materials and Processing 1999, vol. 1:1. Academic Press, Boston, MA. H.S. Nalwa (Ed.).
8. Seshan K., Schepis D.M., Rothman L.B. Handbook of Multilevel Metallization for Integrated Circuits 1993, 274. Noyes Publ., Park Ridge, NJ. S.R. Wilson, C.J. Tracey, J.L. Freeman (Eds.).
9. Auman B.C. Mater. Res. Soc. Symp. Proc. 1995, 381:19.
10. Carter K.R., Cha H.J., Dipietro R.A., Hawker C.J., Hedrick J.L., Labadie J.W., McGrath J.E., Russell T.P., Sanchez M.I., Swanson S.A., Volksen W., Yoon D.Y. Mater. Res. Soc. Symp. Proc. 1995, 381:79.
11. Sillion B., Rabilloud G., Garapon J., Gain O., Vallet J. Mater. Res. Soc. Symp. Proc. 1995, 381:93.
12. Buckly L.J., Snow A., Griffith J., Hu H.S.-W., Ray M. Mater. Res. Soc. Symp. Proc. 1997, 443:3.
13. Hendricks N.J. Mater. Res. Soc. Symp. Proc. 1997, 443:3.
14. Morgen M., Zhao J.-H., Hay M., Cho T., Ho P. Mater. Res. Soc. Symp. Proc. 1999, 565:69.
15. Murarka S.P., Verner I.V., Gutmann R.J. Copper-Fundamental Mechanisms for Microelectronic Applications 2000, Wiley, New York.
16. Nishi Y., Doering R. Handbook of Semiconductor Manufacturing Technology 2000, Marcel Dekker, New York.
17. Polymer-Solid Interfaces 1992, Institute of Phys. Publishing, Philadelphia, PA. J.J. Picreaux, P. Bertrand, J.L. Bredas (Eds.).
18. Materials Research Society Symposium Proceedings 1995, 381. MRS, Pittsburgh, PA.
19. Materials Research Society Symposium Proceedings 1996, 443. MRS, Pittsburgh, PA.
20. Materials Research Society Symposium Proceedings 1997, 476. MRS, Pittsburgh, PA.
21. Materials Research Society Symposium Proceedings 1998, 511. MRS, Pittsburgh, PA.
22. Materials Research Society Symposium Proceedings 1999, 565. MRS, Pittsburgh, PA.
23. Chakraborty A.K. Polymer-Solid Interfaces 1992, 3. Institute of Phys. Publishing, Bristol, UK. J.J. Pireaux, P. Bertrand, J.L. Bredas (Eds.).
24. Pace R.J., Datyner A. J. Polym. Sci. Polym. Eng. 1980, 20:51.
25. Enrilich D., Sillescu H. Macromolecules 1990, 23:1600.
26. Vrenrtas J.S., Duda J.L. J. Appl. Polym. Sci. 1978, 22:2235.
27. Ferry J.D. Viscoelastic Properties of Polymers 1980, Wiley, New York. 3rd edn.
28. Chang C.-A., Baglin J.E.E., Schrott A.G., Lin K.C. Appl. Phys. Lett. 1987, 51:103.
29. Licari J.J., Hughes L.A. Handbook of Polymer Coatings for Electronics - Chemistry, Technology, and Applications 1990, Noyes, Park Ridge, NJ. 2nd edn.
30. Besonov M.I., Koton M.M., Dudryavtsev V.V., Laius L.A. Polyimides - Thermally Stable Polymers 1987, Consultant Bureau, New York.
31. Tromp R.M., LeGoues F.K., Ho P.S. J. Vac. Sci. Technol. A 1985, 3:782.
32. Ohuchi F.S., Freilich S.C. J. Vac. Sci. Technol. A 1986, 4:1039.
33. Bartha J.W., Hahn P.O., LeGoues F.K., Ho P.S. J. Vac. Sci. Technol. A 1985, 3:1390.
34. Faupel F. Adv. Mater. 1990, 2:266.
35. Herdt G.C., Jung D.R., Czanderna H.W. J. Adhes. 1997, 60:197.
36. Wu P.K., Yang G.-R., Ma X.F., Lu T.-M. Appl. Phys. Lett. 1994, 65:508.
37. Ho P.S., Haight R., White R.C., Silverman B.D., Faupel F. Fundamentals of Adhesion 1991, 383. Plenum, New York. L.H. Lee (Ed.).
38. Kowalczik S.P. Metallization of Polymers. ACS Symposium Series 1990, 440:10. American Chemical Society, Washington, DC. E. Sacher, J. Pireaux, S.P. Kowalczik (Eds.).
39. Paik K.W., Ruoff A.L. Mater. Res. Soc. Symp. Proc. 1989, 153:143.
40. Shanker K., McDonald J.F. J. Vac. Sci. Technol. A 1987, 5:2894.
41. Das J.H., Morris J.E. J Appl. Phys. 1989, 66:5816.
42. Yang G.-R., Dabral S., You L., Bakhru H., McDonald J.F., Lu T.-M. Mater. Res. Soc. Symp. Proc. 1991, 203:171.
43. LeGoues F.K., Silverman B.D., Ho P.S. J. Vac. Sci. Technol. A 1988, 6:2200.
44. Wetzel J.T., Smith D.A., Appleby-Moughhham G. Mater. Res. Soc. Symp. Proc. 1985, 40:271.
45. Kovacs G.J., Vincett P.S. J. Colloid Interface Sci. 1982, 90:335.
46. Faupel F., Guta D., Silverman B.D., P.S. Appl. Phys. Lett. 1989, 55:357.
47. Faupel F. Phys. Stat. Sol. (a) 1992, 134:9.
48. Best M.E., Moylan C.R., Ree M. J. Polym. Sci. Polym. Phys. 1991, 29:87.
49. Yang G.-R., Darbral S., You L., McDonald J.F., Lu T.-M., Bakhru H.J. Electron. Mater. 1990, 20:571.
50. Dabral S., Yang G.-R., Bakhru H., Lu T.-M., McDonald J.F. J. Vac. Sci. Technol. A 1992, 10:916.
51. Dabral S., Zhang X., Wang B., Yang G.-R., Lu T.-M., McDonald J.F. Mater. Res. Soc. Symp. Proc. 1995, 381:205.
52. Xie J.Z., Murarka S.P., Guo X.S., Lanford W.A. J. Vac. Sci. Technol. B 1988, 6:1756.
53. Bhushan B., Murarka S.P., Gerlach J. J. Vac. Sci. Technol. B 1990, 8:1068.
54. Sun S.-P. PhD Thesis 1989, RPI, Troy, NY.
55. Lee Y.K. PhD Thesis 1996, RPI, Troy, NY.
56. Lee Y.K., Murarka S.P. J. Mater. Sci. 1998, 33:4105.
57. Lee Y.K., Murarka S.P. J. Mater. Sci. 1998, 33:5423.
58. Mallikarjunan A., Murarka S.P., Lu T.-M. Appl. Phys. Lett. 2001, 79:1855.
59. McBrayer J.D., Swanson R.M., Sigmon T.W. J. Electrochem. Soc. 1986, 133:1242.
60. Shacham-Diamond Y., Dedhia A., Hoffstetter D., Oldham W.G. J. Electrochem. Soc. 1993, 140:2427.
61. Suwwan de Felipe T., Murarka S.P., Bedell S., Lanford W.A. Thin Solid Films 1998, 335:49.
62. Loke A.L.S., Wetzel J., Townsend P., Tanale T., Vrtis R., Zussman M., Kumar D., Ryu C., Wong S. IEEE Trans. Electron Devices 1999, 46:2178.
63. Nguyen T.P., Ettaik H., Lefrant S., Leising G. Polymer-Solid Interfaces 1992, Institute of Physics, Philadelphia, PA. J.J. Picreaux, P. Bertrands, J.L. Bredas (Eds.).
64. Hirose Y., Kahn A., Aristov V., Soukiassian P., Bulovic V., Forrest S.R. Phys. Rev. B 1996, 54:748.
65. Krishnamoorthy, A. and Murarka, S.P., unpublished work.
66. Ho P.S., Hahn P., Bartha J., Rubloff G., LeGoues F. J. Vac. Sci. Technol. A 1985, 3:739.
67. Haight R., White R.C., Silverman B.D., Ho P.S. J. Vac. Sci. Technol. A 1988, 6:2188.
68. Jordan J.L., Kovac C.-A., Morar J.F., Pollack R.A. Phys. Rev. B 1987, 36:1369.
69. Konstadinidis K., Opila R.L., Marcus M.A., Short K., White A.E., Ibidunni O., Davenport A., Isaacs H. X-ray absorption study of Ti and Cr reactions with triazine and polyimide. Electronic Packaging Materials Science VII 1993, Materials Research Society, Pittsburgh, PA.
70. Rossi A.R., Sanda P.N., Silverman B.D., Ho P.S. Organometallics 1987, 6:580.
71. Iucci G., Polzonetti G., Altamura P., Paolucci G., Goldoni A., D'Amato R., Russo M.V. Appl. Surf. Sci. 1999, 153:10.
72. Polzonetti G., Iucci G., Furlani C., Russo M.V., Furlani A., Infante G., Paolucci G., Brena B., Cocco D. Chem. Phys. Lett. 1997, 267:384.
73. Burkstrand J.M. Phys. Rev. B 1979, 20:4853.
74. Gregoire C., Noel Ph., Caudano R., Pireaux J.J. Aluminum - simple model polymer interface formation: an X-ray photoemission study. First International Conference on Polymer-Solid Interfaces 1991, Institute of Physics Publishing, Bristol.
75. Atanasoska L., Anderson S.G., Meyer H.M., Lin Z., Weaver J.H. J. Vac. Sci. Technol. A 1987, 5:3325.
76. Nguyen T.P., Ettaik H., Lefrant S., Leising G. Interface effects in metal-polyparaphenylene-metal structures. First International Conference on Polymer-Solid Interfaces 1991, Institute of Physics Publishing, Bristol.
77. Bartha J.W., Hahn P., LeGouse F.K., Ho P.S. J. Vac. Sci. Technol. A 1985, 3:1390.
78. Vasile M.J., Bachman B.J. J. Vac. Sci. Technol. A 1989, 7:2992.
79. Pireaux J.J., Vermeersch M., Gregoire C., Thiry P.A., Caudano R., Clarke T.C. J. Chem. Phys. 1988, 88:3353.
80. Chung T.G., Yu J., Kim Y.-H., Ahn E.C., Park I.S. An adhesion study of copper and chromium films to polyimide. Electronic Packaging Materials Science VII. Nov. 29-Dec. 3, Boston, MA, USA 1994, Materials Research Society, Pittsburgh, PA.
81. Goldberg M.J., Clabes J.G., Kovac C.A., Vichbeck A. J. Vac. Sci. Technol. A 1988, 6:985.
82. Goldberg M.J., Clabes J.G., Kovac C.A., Vichbeck A. J. Vac. Sci. Technol. A 1988, 6:991.
83. Goldberg M.J., Clabes J.G., Viehbeck A., Kovac C.A. Chromium-polyimide interface chemistry. Electronic Packaging Materials Science Symposium 1987, Mater. Res. Soc., Pittsburgh, PA.
84. Kovac C.A., Jordan-Sweet J.L., Goldberg M.J., Clabes J.G., Viehbeck A., Pollak R.A. IBM J. Res. Deve. 1988, 32:603.
85. Kovac C.A., Jordan J.L., Pollak R.A. Metal atom reactions with polymer films. Electronic Packaging Materials Science II Symposium 1986, Mater. Res. Soc., Pittsburgh, PA.
86. Galuska A.A. J. Vac. Sci. Technol. B 1990, 8:482.
87. Clearfield H.M., Furman B.K., Callegari A., Graham T., Purushothaman S. Factors affecting metal/polymer interface durability in microelectronics packaging: chemistry and water uptake. Electronic Packaging Materials Science VII Nov. 29-Dec. 3, Boston, MA, USA 1993, MRS, Pittsburgh, PA.
88. Girardeaux C., Chambaud G., Delamar M. J. Electron Spectrosc. Relat. Phenom. 1996, 77:209.
89. Unertl W.N. High Performance Polym. 1990, 2:15.
90. Hansen R.H. Thermal Stability of Polymers 1970, Dekker, New York. E.R.T. Conley (Ed.).
91. Chan M.G., Allara D.L. J. Colloid Interface Sci. 1974, 47:697.
92. Allara D.L. Characterization of Metal and Polymer Surfaces 1977, 193-206. Academic Press, New York. H. Lee (Ed.).
93. Allara D.L., White C.W., Meek R.L., Briggs T.H. J. Polym. Sci. Polym. Chem. Ed. 1976, 14:93.
94. Allara D.L., Chan M.G. J. Polym. Sci. Polym. Chem. Ed. 1976, 14:1852.
95. Miller A.C., Czanderna A.W., Jellinek H.H.G., Kachi H. J. Colloid. Interface Sci. 1982, 85:244.
96. Czanderna A.W., Miller A.C., Jellinek A.C., Kachi H. Vac. Sci. Technol. 1977, 14:227.
97. Jellinek H.H.G., Kachi H., Czanderna A., Miller A.C. J. Polym. Sci. Polym. Chem. Ed. 1979, 17:1493.
98. Burrell M.C., Keane J. Surf. Interface Anal. 1988, 11:487.
99. Burrell M.C., Fontana J., Chera J.J. J. Vac Sci. Technol. A 1988, 6:2893.
100. Shih D.Y., Parasyczak J., Klynko N., Flitsh R., Nunes S., Lewis J., Young J. J. Vac. Sci. Technol. A. 1989, 7:1402.
101. Chambers S.A., Chakravorty K.K. J. Vac. Sci. Technol. A 1988, 6:2746.
102. Gregor R.B., Lytle F.W., Sandstrom D.R., Wong K., Shulz P. J. Non-Cryst. Solids 1983, 53:27.
103. Iwamori S., Miyashita T., Fukuda S., Fukuda N., Sudoh K. J. Vac. Sci. Technol. B 1997, 51:53.
104. Chou N.J., Tang C.H. J. Vac. Sci. Technol. A 1984, 2:751.
105. Cadman, P. and Gossedge, G.M. J. Mater. Sci.14, 2672.
106. Roberts R.F., Ryan F.W., Schonhorn H., Sessler G.M., West J.E. Am. Chem. Soc. Div. Polym. Chem. Prepr. 1975, 16:146.
107. Roberts R.F., Ryan F.W., Schonhorn H., Sessler G.M., West J.E. J. Appl. Polym. Sci. 1976, 20:255.
108. Vogel S.L., Schonhorn H. J. Appl. Polym. Sci. 1979, 23:495.
109. Chang C.A., Kim Y.K., Schrott A.G. J. Vac. Sci. Technol. A 1990, 8:3304.
110. Shi M.K., Lamontagne B., Selmani A., Martinu L., Sacher E., Wertheimer M.R., Yelon A. J. Vac. Sci. Technol. A 1994, 12:29.
111. Kim Y.-K., Chang C.-A., Schrott G. J. Appl. Phys. 1990, 67:251.
112. Wheeler D.R., Pepper S.V. J. Vac. Sci. Technol. 1982, 20:442.
113. Stafstrom S., Boman M., Lazzaroni R., Bredas J.-L. Theoretical investigations of the aluminum/polythiophene interface. International Conference on Polymer-Solid Interfaces 1991, Institute of Physics Publishing, Bristol.
114. Dannetun P., Loegdlund M., Fredriksson C., Boman M., Stafstroem S., Salaneck W.R., Kohler B.E., Spangler C. Chemical and electronic structure of early stages of interface formation between aluminum and diphenyltetradecaheptaene. First International Conference on Polymer-Solid Interfaces 1991, Institute of Physics Publishing, Bristol.
115. Burrell M.C., Porta G.M., Karas B.R., Foust D.F., Chera J.J. J. Vac. Sci. Technol. A 1992, 10:2752.
116. Burkstrand J.M. J. Vac. Sci. Technol. 1979, 16:363-1072.
117. Ahn E.C., Yu J., Park I.S. Adhesion strength of CuCr alloy films to polyimide. Electronic Packaging Materials Science VIII, April 17-20, San Francisco, CA 1995, Materials Research Soc., Pittsburgh, PA.
118. Burkstrand J.M. J. Appl. Phys. 1981, 52:4795.
119. Bodo P., Sundgren J.-E. Surf. Interface Anal. 1986, 9:437.
120. Tsukada T., Hosokawa N. J. Vac. Sci. Technol. 1979, 16:349.
121. Andre V., Arefi F., Amouroux J., Lorang G., DePuydt Y., Bertrand P. AES and SSIMS study of the A1-PP adhesion pheomena: correlation to peel test measurements. First International Conferences on Polymer-Solid Interfaces 1991, Institute of Physics, Bristol.
122. Ratchev B.A., Speth R., Was G.S., Mau R., Booske J.H., Jacobs J., Bruen R., Shohet J.L., Fernandez G. Ion beam and RF-plasma modification of metal-polymer interfaces for improved adhesion. IEEE International Conferences on Plasma Science 1995, IEEE, New York.
123. Shih D.-Y., Klymko N., Filsch R., Paraszczak J., Nunes S. J. Vac. Sci. Technol. A 1991, 9:2963.
124. Stewart W.C., Leu J., Jensen K.V. Mater. Res. Soc. Symp. Proc. 1989, 153:285.
125. Anderson S.G., Meyer H.M., Atanasoska L.J., Weaver J.H. J. Vac. Sci. Technol. A 1988, 6:38.
126. Kim Y.-K., Chang C.-A., Schrott A.G., Andreshak J., Cali M. Mater. Res. Soc. Symp. Proc. 1989, 153:279.
127. Takagi T. Mater. Res. Soc. Symp. Proc. 1984, 27:415.
128. Chang C.-A. Appl. Phys. Lett. 1987, 51:1236.
129. Wheeler D.R., Pepper W.S.V. J. Vac Sci. Technol. A 1982, 4:226.
130. Dabral S., Zhang X., Wang G.-R., Lu T-M., McDonald J.F. Mater. Res. Soc. Symp. Proc. 1995, 381:205.
131. Schonhorn H., Ryan F.W. J. Adhes. 1969, 1:43.
132. Ho P.S. Principles of Electronic Pakaging 1989, McGraw-Hill, New York. D.P. Seraphin, R.C. Lusky, C.-Y. Li (Eds.).
133. Resnick P.R. Polym. Prepr. 1990, 31:312.
134. David L., Jerome P., Cuomo J. J. Vac. Sci. Technol. 1991, 9:2704.
135. Pappas D.L., Cuomo J.J. J. Vac. Sci. Technol. A 1991, 9:2714.
136. Paik K.W., Ruoff A.L. Mater. Res. Soc. Symp. Proc. 1988, 119:271.
137. Sengupta K.S., Birnbaum H.K. J. Vac Sci. Technol. A 1991, 9:2928.
138. Jiang W., Norton M.G., Dickinson J.T. Mater. Res. Soc. Symp. Proc. 1993, 304:97.
139. Ho P.S. Appl. Surf. Sci. 1989, 41/42:559.
140. Chang C.-A., Baglin J.E.E., Srott A.G., Lim K.C. Appl. Phys. Lett. 1987, 51:103.
141. Leu J., Jensen K.F. Mater. Res. Soc. Symp. Proc. 1989, 153:181.
142. Krishnamoonthy A., Chanda K., Murarka S.P., Ramnath G., Ryan J.G. Appl. Phys. Lett. 2001, 18:2467.
143. Schwartz P., Schrieber F., Eisenberger P., Scoles G. Surf. Sci. 1999, 423:208.
144. Dressick W.J., Dulcey C.S., Georger J.H., Calabrese G.S., Calvert J.M. J. Electrochem. Soc. 1994, 141:210.
145. Reed M.A., Tour J.M. Sci. Am. 2000, 282:86. and references there in.
146. Vuillaume D., Boulas C., Collet J., Davidovits J.V., Rondelez F. Appl. Phys. Lett. 1996, 69:1646.