Selective, laser-induced etching of fused silica at high scan-speeds using KOH

Journal of Laser Micro Nanoengineering

Volumn 9, Issue 2, 2014, Pages 126-131

  Hermans, Martin ^a,b   Gottmann, Jens ^a,b   Riedel, Frank ^c  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b LightFab UG   (Germany)

^c FRAUNHOFER INSTITUTE FOR LASER TECHNOLOGY   (Germany)

Author keywords

3D; Etching; Fused silica; High speed; Hybrid; KOH; Laser; Machining; Microfluidics; Scanning; Ultrashort

Indexed keywords

FUSED SILICA; LASERS; MACHINING; MICROFLUIDICS; SCANNING; STABILITY CRITERIA;

3D; HIGH-SPEED; HYBRID; KOH; ULTRASHORT;

ETCHING;

EID: 84903199494     PISSN: None     EISSN: 18800688     Source Type: Journal    
DOI: 10.2961/jlmn.2014.02.0009     Document Type: Article

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