Mechanical annealing of Cu-Si nanowires during high-cycle fatigue

MRS Communications

Volumn 4, Issue 3, 2014, Pages 83-87

  Ensslen, Charlotte ^a   Kraft, Oliver ^a   Mönig, Reiner ^a   Xu, Jin ^b   Zhang, Guang Ping ^b   Schneider, Reinhard ^c  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b INSTITUTE OF METAL RESEARCH   (China)

^c KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; FATIGUE OF MATERIALS; GRAIN GROWTH; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; NANOWIRES; TENSILE STRENGTH; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY;

CYCLIC TENSION; DISLOCATION NETWORKS; HIGH CYCLE FATIGUE; HIGH STRENGTH; POST MORTEM; SI NANOWIRE; TENSION TESTS;

SILICON COMPOUNDS;

EID: 84902051323     PISSN: 21596859     EISSN: 21596867     Source Type: Journal    
DOI: 10.1557/mrc.2014.18     Document Type: Article

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