SCOPUS 정보 검색 플랫폼

Volumn 38, Issue , 2013, Pages 362-367

Ni:Si as barrier material for a solderable PVD metallization of silicon solar cells

Author keywords

Long term stability; PVD metallization; Silicon solar cell; Solder connection

Indexed keywords

EID: 84898749141 PISSN: 18766102 EISSN: None Source Type: Conference Proceeding
DOI: 10.1016/j.egypro.2013.07.290 Document Type: Conference Paper

Times cited : (3)

References (7)

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2
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- Long-term stable encapsulated solder joints for Al/Ni:V/Ag metalized silicon solar cells
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4
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- Intermetallic phase growth and reliability of sn-ag-soldered solar cell joints
- P. Schmitt, P. Kaiser, C. Savio, M. Tranitz, U. Eitner. Intermetallic phase growth and reliability of Sn-Ag-soldered solar cell joints. Energy Procedia 2012; 27: 664-669
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- Metallographic preparation of solar cell samples for quality assurance and material evaluation
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- Nickel silicon thin film as barrier in under-bump-matallization by magnetron sputtering deposition for pb-free chip packaging
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7
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- Dynamic carrier lifetime imaging of silicon wafers using an infrared-camera-based approach
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.