Al/Ni: V/Ag metal stacks as rear-side metallization for crystalline silicon solar cells

Progress in Photovoltaics: Research and Applications

Volumn 21, Issue 5, 2013, Pages 876-883

  Jung, Verena ^a   Köntges, Marc ^a  

^a INSTITUTE FOR SOLAR ENERGY RESEARCH HAMELIN ISFH   (Germany)

Author keywords

intermetallic compound growth; long term stability; metallization; peel force; solar cells

Indexed keywords

BACKSCATTERED ELECTRON IMAGING; CRYSTALLINE SILICON SOLAR CELLS; ENERGY DISPERSIVE X-RAY; INTERMETALLIC COMPOUND GROWTHS; LONG TERM STABILITY; MICROELECTRONIC INDUSTRY; PEEL FORCE; SECONDARY ELECTRON MICROSCOPY;

ACTIVATION ENERGY; COPPER; EXPERIMENTS; INTERMETALLICS; METALLIZING; MICROELECTRONICS; NICKEL; PHOTOVOLTAIC CELLS; REACTION KINETICS; SILICON SOLAR CELLS; SILVER; SOLAR CELLS; SOLDERING; SOLDERING ALLOYS; THERMAL AGING; TIN COMPOUNDS;

TIN;

EID: 84881231870     PISSN: 10627995     EISSN: 1099159X     Source Type: Journal    
DOI: 10.1002/pip.2169     Document Type: Article

References (22)

1. Osenbach J, Amin A, Bachman M, Baiocchi F, Bitting D, Crouthamel D, DeLucca J, Gerlach D, Goodell J, Peridier C, Stahley M, Weachock R,. Stability of flip-chip interconntects assembled with Al/Ni(V)/Cu-UBM and eutectic Pb-Sn solder during exposure to high-temperature storage. Journal of Electronic Materials 2009; 38 (2): 303-324.
2. Jang GY, Duh JG,. Elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-bump metallization during aging. Journal of Electronic Materials 2006; 35 (11): 2061-2070.
3. Lin YL, Chang CW, Tsai CM, Lee CW, Kao CR,. Electromigration-induced UBM consumption in flip-chip solder joints. Journal of Electronic Materials 2006; 35 (5): 1010-1016.
4. Jang SY, Paik KW,. Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion. Soldering & Surface Mount Technology 1998; 10 (3): 29-37.
5. Choi WJ, Yeh ECC, Tu KN,. Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization. Journal of Applied Physics 2003; 94 (9): 5665-5671.
6. Chen CC, Chen SW, Chang CH,. Characterization of the ternary phase at the Sn/Ni-V joint. Journal of Materials Research 2008; 23 (10): 2743-2748.
7. Chen CC, Chen SW, Kao CY,. Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-rich corner. Journal of Electronic Materials 2006; 35 (5): 922-928.
8. Wang KJ, Tsai YZ, Duh JD, Shih TY,. Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization. Journal of Electronic Materials 2009; 24 (8): 2638-2643.
9. Heinemeyer F, Mader C, Münster D, Dullweber T, Harder NP, Brendel R,. Inline high-rate thermal evaporation of aluminium as a novel industrial solar cell metallization scheme. Proceedings of the 2nd Workshop on Metallization, Constance, Germany, 2010; 48-51.
10. Grohe A,. Einsatz von Laserverfahren zur Prozessierung von kristallinen Silicium-Solarzellen. Dissertation, Universität Konstanz, Fachbereich Physik, 2008.
11. 4 layer during reactive diffusion between Ni and Sn at sold state temperatures. Materials Science and Engineering A 2005; 403: 268-275.
12. 3P layer between Sn-3.5Ag solder and electroless Ni-P substrate. Journal of Alloys and Compounds 2004; 376: 105-110.
13. 4 at the Sn-3.5Ag solder/Ni interface. Journal of Applied Physics 2005; 98: 123527.
14. Choi S, Bieler TR, Lucas JP, Subramanian KN,. Characterization of the growth of intermetallic interfacial layer of Sn-Ag and Sn-Pb eutectic solders and their composite solders on substrate during isothermal long-term aging. Journal of Electronic Materials 1999; 28 (11): 1209-1215.
15. Lee TY, Choi WJ, Tu KN, Jang JW, Kuo SM, Lin JK, Frear DR, Zeng K, Kivilahti JK. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu. Journal of Materials Research 2002; 17 (2): 291-301.
16. Choi WK, Lee HM,. Effect of soldering and aging time on interfacial microstructure and growth on intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate. Journal of Electronic Materials 2000; 29 (10): 1207-1413.
17. Bradley E, Handwerker C, Bath J,. Lead-free electronics: iNEMI projects lead to successful manufacturing. Wiley: Hoboken, NJ, 2007; 29-33.
18. Chen SW, Wu SH, Lee SW,. Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) Systems. Journal of Electronic Materials 2003; 32 (11): 1188-1194.
19. Chen SW, Wang CH,. Interfacial reactions of Sn-Cu/Ni couples at 250°C. Journal of Materials Research 2006; 21 (9): 2270-2277.
20. Hollemann AF, Wiberg E, Wiberg N,. Lehrbuch der anorganischen Chemie. de Gruyter: Berlin, 2007; 1710.
21. He M, Lau WH, Qi G, Chen Z,. Intermetallic compound formation between Sn-3.5Ag solder and Ni-based metallization during liquid state reaction. Thin Solid Films 2004; 462-463: 376-383.
22. Koehl M, Heck M, Wiesmeier S, Wirth J,. Modeling of the nominal operating cell temperature based on outdoor weathering. Solar Energy Materials and Solar Cells 2011; 95 (7): 1638-1646. DOI: 10.1016/j.solmat.2011.01.020.