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Volumn 8, Issue , 2011, Pages 402-408

Metallographic preparation of solar cell samples for quality assurance and material evaluation

Author keywords

Material evaluation; Metallography; PV modules; Quality assurance; Solar cells

Indexed keywords

CHARACTERIZATION; METALLOGRAPHY; PHOTOVOLTAIC CELLS; QUALITY ASSURANCE; SILICON WAFERS; SOLAR CELLS; SOLDERING;

EID: 80052096162     PISSN: 18766102     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.egypro.2011.06.157     Document Type: Conference Paper
Times cited : (11)

References (9)
  • 1
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    • Cell production 2010 survey "Year of the tiger"
    • 03-2011
    • G. Hering. Cell production 2010 survey "Year of the tiger", Photon international, pp. 186 - 218; 03-2011; 2011.
    • (2011) Photon International , pp. 186-218
    • Hering, G.1
  • 2
    • 79958152673 scopus 로고    scopus 로고
    • Metallographic sample preparation of soldered solar cells
    • 5-2011
    • D. Eberlein, P. Schmitt, P. Voos. Metallographic Sample Preparation of Soldered Solar Cells, Practical Metallography, pp. 239 - 260; 5-2011; 2011.
    • (2011) Practical Metallography , pp. 239-260
    • Eberlein, D.1    Schmitt, P.2    Voos, P.3
  • 5
    • 80052082419 scopus 로고    scopus 로고
    • Tabbing-stringing quality control challenges
    • Ninth Edition
    • H. Wirth. Tabbing-stringing quality control challenges, Photovoltaics International, Ninth Edition; pp.160 - 169; 2010.
    • (2010) Photovoltaics International , pp. 160-169
    • Wirth, H.1
  • 6
    • 0942266970 scopus 로고    scopus 로고
    • Influence of initial morphology and thickness of Cu6Sn5 and cu3sn intermetallics on growth and evolution during thermal aging of Sn-Ag Solder/Cu joints
    • X. Deng, G. Piotrowski, J.J. Williams, N. Chawla. Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints, Journal of Electronic Materials, Vol. 32, No. 12; pp. 1403 - 1413; 2003.
    • (2003) Journal of Electronic Materials , vol.32 , Issue.12 , pp. 1403-1413
    • Deng, X.1    Piotrowski, G.2    Williams, J.J.3    Chawla, N.4
  • 7
    • 33645875999 scopus 로고    scopus 로고
    • Schädigungsmechanismen in lötverbindungen bei erhöhter temperatur
    • M.-H. Poech, Schädigungsmechanismen in Lötverbindungen bei erhöhter Temperatur, VTE, 14-1, pp. 12 - 18; 2002.
    • (2002) VTE , vol.14 , Issue.1 , pp. 12-18
    • Poech, M.-H.1
  • 8
    • 0003831179 scopus 로고    scopus 로고
    • 2nd Edition; Ayr: Electrochemical Publications Ltd., and p.662
    • R.J. Klein Wassink. Soldering in Electronics, 2nd Edition; Ayr: Electrochemical Publications Ltd., p.614 and p.662; 1998.
    • (1998) Soldering in Electronics , pp. 614
    • Wassink, R.J.K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.