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Volumn 21, Issue , 2012, Pages 84-91

Long-term stable encapsulated solder joints on an Al/Ni:V/Ag metallization for silicon solar cells

Author keywords

Crystalline silicon; Evaporation; Laminate; Long term stable; Metallization; Solar cell; Solder joint; Sputtering

Indexed keywords


EID: 84897096047     PISSN: 18766102     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.egypro.2012.05.011     Document Type: Conference Paper
Times cited : (7)

References (9)
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    • doi:10.1016/j.solmat.2011.06.031
    • C. Mader, M. Kessler, U. Eitner, and R. Brendel, Temperature of silicon wafers during in-line high-rate evaporation of Aluminum, Sol. Energy Mater. Sol. Cells, vol. 95, no. 11, pp. 3047-53, 2011, doi:10.1016/j.solmat.2011.06.031.
    • (2011) Sol. Energy Mater. Sol. Cells , vol.95 , Issue.11 , pp. 3047-3053
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  • 5
    • 84881231870 scopus 로고    scopus 로고
    • AL/NI:V/ag metal stacks as rear-side metallization for crystalline silicon solar cells
    • DOI: 10.1002/pip.2169. IEEE Potovoltaic Specialists Conference (PVSC), Philadelphia, USA, 2009
    • V.Jung, M. Köntges, Al/Ni:V/Ag metal stacks as rear-side metallization for crystalline silicon solar cells, Prog. Photovolt: Res. Appl., 2012, DOI: 10.1002/pip.2169. IEEE Potovoltaic Specialists Conference (PVSC), Philadelphia, USA, 2009.
    • (2012) Prog. Photovolt: Res. Appl.
    • Jung, V.1    Köntges, M.2
  • 6
    • 58349110742 scopus 로고    scopus 로고
    • Stability of flip-chip interconnects assembled with Al/Ni(V)/CU-UBM and eutectic pb-sn solder during exposure to high-temperature storage
    • J. Osenbach, A. Amin, M. Bachman, F. Baiocchi, D. Bitting, D. Crouthamel, et al., Stability of flip-chip interconnects assembled with Al/Ni(V)/Cu-UBM and eutectic Pb-Sn solder during exposure to high-temperature storage, J. Electron. Mater., vol. 38, no. 2, pp. 303 - 24, 2009.
    • (2009) J. Electron. Mater. , vol.38 , Issue.2 , pp. 303-324
    • Osenbach, J.1    Amin, A.2    Bachman, M.3    Baiocchi, F.4    Bitting, D.5    Crouthamel, D.6
  • 7
    • 33845729438 scopus 로고    scopus 로고
    • Elemental redistribution and interfacial reaction mechanism for the flip chip sn-3.0ag-(0.5 or 1.5)cu solder bump with Al/Ni(V)/Cu under-bump metallisation during aging
    • G.Y. Jang, J.G. Duh, Elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-bump metallisation during aging, J. Electron. Mater., vol. 35, no. 11, pp. 2061-70, 2006.
    • (2006) J. Electron. Mater. , vol.35 , Issue.11 , pp. 2061-2070
    • Jang, G.Y.1    Duh, J.G.2
  • 8
    • 0242721171 scopus 로고    scopus 로고
    • Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film underbump- metallization
    • W.J. Choi, E.C.C. Yeh, K.N. Tu, Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film underbump- metallization, J. Appl. Phys., vol. 94, no. 9, pp. 5665-71, 2003.
    • (2003) J. Appl. Phys. , vol.94 , Issue.9 , pp. 5665-5671
    • Choi, W.J.1    Yeh, E.C.C.2    Tu, K.N.3
  • 9
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    • Use of digital image correlation technique to determine thermomechanical deformations in photovoltaic laminates: Measurements and accuracy
    • doi:10.1016/j.solmat.2010.03.028
    • U. Eitner, M. Köntges, and R. Brendel, Use of digital image correlation technique to determine thermomechanical deformations in photovoltaic laminates: Measurements and accuracy, Sol. Energy Mater. Sol. Cells, vol. 94, pp. 1346-51, 2010, doi:10.1016/j.solmat.2010.03.028.
    • (2010) Sol. Energy Mater. Sol. Cells , vol.94 , pp. 1346-1351
    • Eitner, U.1    Köntges, M.2    Brendel, R.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.