Stability of flip-chip interconnects assembled with Al/Ni(V)/Cu-UBM and eutectic Pb-Sn solder during exposure to high-temperature storage

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 303-324

  Osenbach, J ^a   Amin, A ^b   Bachman, M ^a   Baiocchi, F ^a   Bitting, D ^c   Crouthamel, D ^d   Delucca, J ^a   Gerlach, D ^a   Goodell, J ^a   Peridier, C ^a   Stahley, M ^a   Weachock, R ^a  

^a LSI Corporation   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c IBM   (United States)

^d STATSChipPac   (United States)

Author keywords

Degradation; Flip chip; UBM

Indexed keywords

AU LAYERS; CHIP INTERCONNECTS; ELECTRICAL DEGRADATIONS; ELECTROLESS; FLIP CHIP; HIGH TEMPERATURES; INTERMETALLIC COMPOUNDS; INTRINSIC RESISTIVITIES; ION BEAM MICROSCOPIES; METALIZATION; MICROSTRUCTURAL CHARACTERIZATIONS; RESISTANCE DEGRADATIONS; SCANNING AND TRANSMISSION ELECTRON MICROSCOPIES; SOLDER JOINTS; SURFACE FINISHES; THERMAL STABILITIES; TRILAYER; UBM;

BRAZING; COPPER; CRYSTAL GROWTH; DEGRADATION; ELECTRON ENERGY LOSS SPECTROSCOPY; EUTECTICS; FLIP CHIP DEVICES; GOLD; GRAIN BOUNDARIES; HEATING; INTERMETALLICS; JOULE HEATING; LEAD; LEAD ALLOYS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; SUBSTRATES; SYSTEM STABILITY; THERMODYNAMIC STABILITY; WELDING;

TIN;

EID: 58349110742     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0599-9     Document Type: Article

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