Enabling a manufacturable 3D technologies and ecosystem using 28nm FPGA with stack silicon interconnect technology

46th International Symposium on Microelectronics, IMAPS 2013

Volumn , Issue , 2013, Pages 217-222

  Kwon, Woon Seong ^a   Kim, Myongseob ^a   Chang, Jonathan ^a   Ramalingam, Suresh ^a   Madden, Liam ^a   Tsai, Genie ^b   Tseng, Stephen ^b   Lai, J Y ^b   Lu, Terren ^c   Chiu, Steve ^b  

^a XILINX INC   (United States)

^b SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

^c NONE

Author keywords

Interposer; Manufacturing yield; Micro joining; Stacked silicon interconnect technology; Warpage

Indexed keywords

ECOSYSTEMS; ELECTRONICS PACKAGING; FIELD PROGRAMMABLE GATE ARRAYS (FPGA); JOINING; MICROELECTRONICS;

INTERPOSER; MANUFACTURING YIELD; MICRO-JOINING; SILICON INTERCONNECT TECHNOLOGY; WARPAGES;

TECHNOLOGY;

EID: 84897386129     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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