Ductility enhancement in Sn-40Bi-X alloys by minor additions of alloying elements

Journal of Korean Institute of Metals and Materials

Volumn 49, Issue 3, 2011, Pages 211-220

  Kim, Ju Hyung ^a   Lee, Jong Hyun ^a  

^a Seoul National University of Science and Technology   (South Korea)

Author keywords

Alloys; Ductility; Sn Bi solder; Soldering; Tensile test

Indexed keywords

BI-BASED; DUCTILITY ENHANCEMENT; HIGH-STRAIN-RATE; HOMOGENEOUS MICROSTRUCTURE; MICROSTRUCTURE CHANGES; SN-BI SOLDER; SOLDER ALLOYS; STRAIN STRESS CURVE; TENSILE TESTING MACHINES; TENSILE TESTS; ULTIMATE TENSILE STRENGTH;

ALLOYING; ALLOYING ELEMENTS; ALLOYS; BISMUTH; CERIUM ALLOYS; DUCTILITY; GRAIN BOUNDARIES; GRAIN BOUNDARY SLIDING; GRAIN SIZE AND SHAPE; MANGANESE; MATERIALS TESTING APPARATUS; MICROSTRUCTURE; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TENSILE STRENGTH; TENSILE TESTING; TIN; TIN ALLOYS;

STRAIN RATE;

EID: 79955408826     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: 10.3365/KJMM.2011.49.3.211     Document Type: Article

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