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Volumn 41, Issue 2, 2012, Pages 362-374

Dependence of Sn grain morphology of Sn-Ag-Cu solder on solidification temperature

Author keywords

electron backscattered diffraction (EBSD); growth; microstructure; nucleation; Pb free solder; solidification temperature

Indexed keywords

AG ATOMS; DIFFERENT SIZES; ELECTRON BACK-SCATTERED DIFFRACTION; HEXAGONAL CONFIGURATION; INTERMEDIATE DEGREE; PB FREE SOLDERS; SN GRAINS; SN-AG-CU; SNAGCU SOLDER; SOLIDIFICATION TEMPERATURE;

EID: 84855443708     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-011-1756-0     Document Type: Article
Times cited : (102)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.