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Volumn 80, Issue , 2012, Pages 103-105
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Impact crack propagation through the dual-phased (Cu,Ni) 6Sn 5 layer in Sn-Ag-Cu/Ni solder joints
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Author keywords
Electronic materials; Indentation and hardness; Interfaces; Metallurgy; Microstructure
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Indexed keywords
CRACK NUCLEATION;
ELECTRONIC MATERIALS;
HIGH SPEED IMPACT;
IMPACT FRACTURE;
IMPACT FRACTURE BEHAVIOR;
SN-AG-CU;
SOLDER JOINTS;
CRACKS;
HARDNESS;
INTERFACES (MATERIALS);
INTERMETALLICS;
METALLURGY;
MICROSTRUCTURE;
SILVER;
SOLDERING ALLOYS;
TIN;
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EID: 84861610891
PISSN: 0167577X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.matlet.2012.04.099 Document Type: Article |
Times cited : (23)
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References (11)
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