메뉴 건너뛰기




Volumn 80, Issue , 2012, Pages 103-105

Impact crack propagation through the dual-phased (Cu,Ni) 6Sn 5 layer in Sn-Ag-Cu/Ni solder joints

Author keywords

Electronic materials; Indentation and hardness; Interfaces; Metallurgy; Microstructure

Indexed keywords

CRACK NUCLEATION; ELECTRONIC MATERIALS; HIGH SPEED IMPACT; IMPACT FRACTURE; IMPACT FRACTURE BEHAVIOR; SN-AG-CU; SOLDER JOINTS;

EID: 84861610891     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2012.04.099     Document Type: Article
Times cited : (23)

References (11)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.