Interfacial reactions and mechanical properties of Bi-x wt.%Sn/Cu joints (x = 2, 5, 10)

Journal of Electronic Materials

Volumn 41, Issue 12, 2012, Pages 3303-3308

  Wang, Jin Yi ^a   Lin, Chih Fan ^a   Chen, Chih Ming ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

High temperature solder; Interfacial reaction; Isothermal section; Shear strength

Indexed keywords

ALLOY COMPOSITIONS; CU SUBSTRATE; HIGH TEMPERATURE; INTERFACIAL MICROSTRUCTURE; ISOTHERMAL SECTIONS; MECHANICAL TESTS; SN ALLOYS;

CERIUM ALLOYS; INTERMETALLICS; ISOTHERMS; LEAD; MECHANICAL PROPERTIES; PHASE STABILITY; SHEAR STRENGTH; SOLDERING ALLOYS; SURFACE CHEMISTRY; TIN; TIN ALLOYS;

COPPER ALLOYS;

EID: 84869492335     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2230-3     Document Type: Article

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