Retardation of the Cu5Zn8 phase fracture and improvement of shear strength of the Sn-9 wt pct Zn/Cu interface by inserting an electroless palladium layer

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 44, Issue 1, 2013, Pages 125-130

  Lee, Po Hsun ^a   Lin, Chi Pu ^a   Chen, Chih Ming ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC INTERDIFFUSION; ELECTROLESS; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUND GROWTHS; JOINT INTERFACES; MECHANICAL TESTS; MICROSTRUCTURAL STABILITY; PALLADIUM LAYERS; SN-9ZN SOLDER; SOLID-STATE AGING; UNIFORM LAYER;

FRACTURE; PALLADIUM; PHASE INTERFACES; SOLDERING ALLOYS; ZINC;

TIN;

EID: 84872004683     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-012-1377-0     Document Type: Article

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