Characterization of 3D-printed microfluidic chip interconnects with integrated O-rings

Sensors and Actuators, A: Physical

Volumn 205, Issue , 2014, Pages 199-203

  Paydar, O H ^a   Paredes, C N ^b   Hwang, Y ^b   Paz, J ^b,c   Shah, N B ^b   Candler, R N ^b,d  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b University of California   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

^d CALIFORNIA NANOSYSTEMS INSTITUTE   (United States)

Author keywords

3D printing; Interconnects; Microfluidics; Packaging; Polydimethylsiloxane (PDMS), Customizable

Indexed keywords

3D-PRINTING; ACADEMIC ENVIRONMENT; COMPUTER AIDED DESIGN MODELS; CUSTOMIZABLE; LAB-ON-A-CHIP DEVICES; MICROFLUIDIC INTERCONNECT; MICROFLUIDIC INTERCONNECTS; PACKAGING TECHNOLOGIES;

COMPUTER AIDED DESIGN; O RINGS; OPTICAL INTERCONNECTS; PACKAGING; PRINTING; SILICONES; THREE DIMENSIONAL;

MICROFLUIDICS;

EID: 84890282745     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2013.11.005     Document Type: Article

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