Interlocking mechanical and fluidic interconnections for microfluidic circuit boards

Sensors and Actuators, A: Physical

Volumn 112, Issue 1, 2004, Pages 18-24

  Gray, Bonnie L ^a,b   Collins, Scott D ^a   Smith, Rosemary L ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Deep reactive ion etching; Interconnects; Microfluidic systems; Packaging

Indexed keywords

FLOW CONTROL; FLUID STRUCTURE INTERACTION; MATHEMATICAL MODELS; PHOTOLITHOGRAPHY; PLASTIC DEFORMATION; RAPID PROTOTYPING; REACTIVE ION ETCHING;

DEEP REACTIVE ION ETCHING (DRIE); FLOW RATES; MICROFLUIDIC CIRCUIT BOARDS; MICROFLUIDIC SYSTEMS;

FLUIDICS;

EID: 2142701455     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.10.073     Document Type: Article

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