Modular microfluidic interconnects using photodefinable silicone microgaskets and MEMS O-rings

Sensors and Actuators, A: Physical

Volumn 143, Issue 1, 2008, Pages 7-13

  Miserendino, Scott ^a   Tai, Yu Chong ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Interconnects; Microgaskets; Modular microfluidics; Packaging; Silicone

Indexed keywords

COMPRESSIVE STRESS; GASKETS; MEMS; OPTICAL INTERCONNECTS; PHOTOSENSITIVITY; SILICONES;

CHIP-TO-CHIP INTERCONNECTS; MICROGASKETS; MODULAR MICROFLUIDICS;

MICROFLUIDICS;

EID: 40949087277     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.07.019     Document Type: Article

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