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Volumn 2, Issue 2, 2014, Pages 286-294

Fabrication of flexible copper-based electronics with high-resolution and high-conductivity on paper via inkjet printing

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; INK JET PRINTING; SINTERING;

EID: 84890060123     PISSN: 20507534     EISSN: 20507526     Source Type: Journal    
DOI: 10.1039/c3tc31740d     Document Type: Article
Times cited : (108)

References (41)
  • 34
    • 0011269787 scopus 로고
    • ASTM Standard D3359
    • ASTM International, Philadelphia PA 10.1520/D3359-09E02
    • Test Methods for Measuring Adhesion by Tape Test, ASTM Standard D3359, ASTM International www.astm.org, Philadelphia PA, 1994, Vol. 6.01 10.1520/D3359-09E02
    • (1994) Test Methods for Measuring Adhesion by Tape Test , vol.601


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.