Stretchable copper interconnects with three-dimensional coiled structures

Journal of Micromechanics and Microengineering

Volumn 23, Issue 12, 2013, Pages

  Park, Chan Woo ^a   Jung, Soon Won ^a   Lim, Sang Chul ^a   Oh, Ji Young ^a   Na, Bock Soon ^a   Lee, Sang Seok ^a   Chu, Hye Yong ^a   Koo, Jae Bon ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER INTERCONNECTS; CYCLIC DEFORMATIONS; ELASTOMERIC SUBSTRATES; ELECTRICAL CONDUCTIVITY; ELECTROPLATING PROCESS; HIGH MECHANICAL STRENGTH; LOCAL STRESS CONCENTRATION; METAL INTERCONNECTS;

COPPER; DEFORMATION; ELECTRODES; STRESS CONCENTRATION;

THREE DIMENSIONAL;

EID: 84889060221     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/12/127002     Document Type: Article

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