Thin-film stretchable electronics technology based on meandering interconnections: Fabrication and mechanical performance

Journal of Micromechanics and Microengineering

Volumn 22, Issue 1, 2012, Pages

  Verplancke, R ^a   Bossuyt, F ^a   Cuypers, D ^a   Vanfleteren, J ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLIC MECHANICAL LOADING; ELECTRICAL INTERCONNECTIONS; ELECTRONIC COMPONENT; FABRICATION TECHNOLOGIES; GOLD FILM; HIGH TEMPERATURE; MECHANICAL PERFORMANCE; POTASSIUM CHLORIDE; SILICONE ELASTOMERS; STRETCHABLE ELECTRONICS; TEST STRUCTURE; THICK LAYERS;

CHLORINE COMPOUNDS; GOLD COATINGS; POLYIMIDES; POTASSIUM; SILICONES; TECHNOLOGY;

FABRICATION;

EID: 84855782496     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/1/015002     Document Type: Article

References (22)

1. Yu Z, Graudejus O, Tsay C, Lacour S P, Wagner S and Morrison B 2009 Monitoring hippocampus electrical activity in vitro on an elastically deformable microelectrode array J. Neurotraum. 26 1135-45
2. Graudejus O, Yu Z, Jones J, Morrison B and Wagner S 2009 Characterization of an elastically stretchable microelectrode array and its application to neural field potential recordings J. Electrochem. Soc. 156 P85-94
3. Wei P, Taylor R, Ding Z, Higgs G, Norman J J, Pruitt B L and Ziaie B 2009 A stretchable cell culture platform with embedded electrode array Proc. 22nd IEEE Int. Conf. on Micro Electro Mechanical Systems (Sorrento, 25-29 January 2009) pp 407-10
4. Urdaneta M G, Delille R and Smela E 2007 Stretchable electrodes with high conductivity and photo-patternability Adv. Mater. 19 2629-33 (Pubitemid 47481826)
5. Sekitani T, Noguchi Y, Hata K, Fukushima T, Aida T and Someya T 2008 A rubberlike stretchable active matrix using elastic conductors Science 321 1468-72
6. Kim D H and Rogers J A 2008 Stretchable electronics: materials strategies and devices Adv. Mater. 20 4887-92
7. Kim D H, Xiao J, Song J, Huang Y and Rogers J A 2010 Stretchable, curvilinear electronics based on inorganic materials Adv. Mater. 22 2108-24
8. Kim D H et al 2011 Materials for multifunctional balloon catheters with capabilities in cardiac electrophysiological mapping and ablation therapy Nat. Mater 10 316-23
9. Wagner S, Lacour S P, Jones J, Hsu P I, Sturm J C, Li T and Suo Z 2004 Electronic skin: architecture and components Physica E 25 326-34
10. Lacour S P, Chan D, Wagner S, Li T and Suo Z 2006 Mechanisms of reversible stretchability of thin metal films on elastomeric substrates Appl. Phys. Lett. 88 204103
11. Graz I M, Cotton D P J and Lacour S P 2009 Extended cyclic uniaxial loading of stretchable gold thin-films on elastomeric substrates Appl. Phys. Lett. 94 071902
12. Gray D S, Tien J and Chen C S 2004 High-conductivity elastomeric electronics Adv. Mater. 16 393-97
13. Brosteaux D, Axisa F, Gonzalez M and Vanfleteren J 2007 Design and fabrication of elastic interconnections for stretchable electronic circuits IEEE Electron Device Lett. 28 552-54 (Pubitemid 47040451)
14. Bossuyt F, Guenther J, Löher T, Seckel M, Sterken T and de Vries J 2011 Cyclic endurance reliability of stretchable electronic substrates Microelectron. Reliab. 51 628-35
15. Christiaens W, Bosman E and Vanfleteren J 2010 UTCP: a novel polyimide based ultra-thin chip packaging technology IEEE Trans. Compon. Pack. Technol. 33 754-60
16. Gonzalez M, Axisa F, Bulcke M V, Brosteaux D, Vandevelde B and Vanfleteren J 2008 Design of metal interconnects for stretchable electronic circuits Microelectron. Reliab. 48 825-32
17. Sterken T, Bossuyt F, Verplancke R, Vervust T, Axisa F and Vanfleteren J 2010 Lifetime of stretchable meander shaped copper conductors in PDMS subjected to cyclic elongation MRS Spring Meeting (San Francisco, CA, 5-9 April 2010)
18. Hsu Y Y, Gonzalez M, Bossuyt F, Vanfleteren J and De Wolf I 2011 Polyimide-enhanced stretchable interconnects: design, fabrication and characterization IEEE Trans. Electron Devices 58 2680-8
19. HD Microsystems Product Bulletin of PI-2600 series, available from http://hdmicrosystems.com/ - ref-separator -
20. Metz S, Bertsch A and Renaud P 2005 Partial release and detachment of microfabricated metal and polymer structures by anodic metal dissolution J. Microelectromech. Syst. 14 383-91 (Pubitemid 40679628)
21. Montgomery D C 2005 Design and Analysis of Experiments 6th edn (Arizona: Wiley) p 203
22. Hsu Y Y, Gonzalez M, Bossuyt F, Axisa F, Vanfleteren J and De Wolf I 2010 The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit J. Micromech. Microeng. 20 075036